Printed circuit board

A printed circuit board, comprising:

• a first insulating layer including a non-photosensitive insulating material;
• a first wiring layer embedded in the first insulating layer, where an upper surface thereof is exposed from an upper surface of the first insulating layer, and which includes a first metal layer and a second metal layer covering at least a portion of each of lower surface and side surface of the first metal layer with a thickness thinner than the first metal layer;
• and
• a second insulating layer disposed under the lower surface of the first insulating layer, covering at least a portion of a lower surface of the first wiring layer, and including the non-photosensitive insulating material,
• wherein the upper surface of the first wiring layer is recessed downward from the upper surface of the first insulating layer in a direction on which the first insulating layer and the second insulating layer are disposed, and the upper surface of the first wiring layer has a step difference from the upper surface of the first insulating layer.

A printed circuit board, comprising:

• a first insulating layer including a non-photosensitive insulating material;
• a first wiring layer embedded in the first insulating layer, where an upper surface thereof is exposed from an upper surface of the first insulating layer, and which includes a first metal layer and a second metal layer covering at least a portion of each of lower surface and side surface of the first metal layer with a thickness thinner than the first metal layer;
• and
• a second insulating layer disposed under the lower surface of the first insulating layer, covering at least a portion of a lower surface of the first wiring layer, and including the non-photosensitive insulating material, wherein at least a portion of the upper surface of the first wiring layer is convex upward from the upper surface of the first insulating layer.

A printed circuit board, comprising:

• an insulating layer including a non-photosensitive insulating material;
• a first wiring layer embedded in an upper side of the insulating layer, where an upper surface thereof is exposed from the upper surface of the insulating layer, and which includes a first metal layer and a second metal layer covering at least a portion of each of lower surface and side surface of the first metal layer with a thickness thinner than the first metal layer, wherein the first wiring layer has a vertical side surface;
• a second wiring layer embedded in a lower side of the insulating layer, in which a lower surface thereof is exposed from the lower surface of the insulating layer;
• and
• a via which is disposed in a via hole penetrating the insulating layer to electrically connect the first and second wiring layers, and includes a wall surface of the via hole and the second metal layer extending above an upper surface exposed of the second wiring layer through the via hole, and the first metal layer extending into the via hole,
• wherein the insulating layer includes first and second insulating layers, the first wiring layer is embedded in the first insulating layer where an upper surface thereof is exposed from an upper surface of the first insulating layer, and the second wiring layer is embedded in the second insulating layer and a lower surface thereof is exposed from a lower surface of the second insulating layer,
• wherein the insulating layer further includes a third insulating layer disposed between the first and second insulating layers, and the via hole penetrates the third insulating layer, and
• wherein boundaries of the first and third insulating layers are separated from each other, and boundaries of the second and third insulating layers are separated from each other.