Printed circuit board
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorIn Gun KIM
Life of this patent
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Abstract
The present disclosure relates to a printed circuit board including a first insulating layer including a non-photosensitive insulating material, a first wiring layer embedded in the first insulating layer, where an upper surface thereof is exposed from the upper surface of the first insulating layer, includes a first metal layer, and a second metal layer covering at least a portion of each of the lower surface and side surface of the first metal layer with a thickness thinner than the first metal layer, and a second insulating layer disposed under the lower surface of the first insulating layer to cover at least a portion of a lower surface of the first wiring layer, and including the non-photosensitive insulating material.
Claims16
A printed circuit board, comprising:
- a first insulating layer including a non-photosensitive insulating material;
- a first wiring layer embedded in the first insulating layer, where an upper surface thereof is exposed from an upper surface of the first insulating layer, and which includes a first metal layer and a second metal layer covering at least a portion of each of lower surface and side surface of the first metal layer with a thickness thinner than the first metal layer;
- and
- a second insulating layer disposed under the lower surface of the first insulating layer, covering at least a portion of a lower surface of the first wiring layer, and including the non-photosensitive insulating material.
A printed circuit board, comprising:
- an insulating layer including a non-photosensitive insulating material;
- a first wiring layer embedded in an upper side of the insulating layer, where an upper surface thereof is exposed from the upper surface of the insulating layer, and which includes a first metal layer and a second metal layer covering at least a portion of each of lower surface and side surface of the first metal layer with a thickness thinner than the first metal layer, wherein the first wiring layer has a vertical side surface.
Dependencies are inferred from the claim text.