H05K 2203/1563
Reversing the pcb
Official title: Reversing the PCB
H05K2203/1563 (Reversing the pcb) appears on 56 US grants and 48 published applications in this corpus.
Search patents in H05K- Granted patents
- 56
- Published applications
- 48
- Assignees
- 55
- Inventors
- 147
- Latest grant
- 26 Aug 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1980 | 1 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 1 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 1 | 0 |
| 1990 | 4 | 0 |
| 1991 | 1 | 0 |
| 1992 | 1 | 0 |
| 1993 | 5 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 3 | 0 |
| 1998 | 1 | 0 |
| 1999 | 0 | 0 |
| 2000 | 2 | 0 |
| 2001 | 1 | 2 |
| 2002 | 2 | 2 |
| 2003 | 2 | 1 |
| 2004 | 1 | 1 |
| 2005 | 0 | 1 |
| 2006 | 1 | 2 |
| 2007 | 0 | 1 |
| 2008 | 0 | 1 |
| 2009 | 1 | 1 |
| 2010 | 0 | 2 |
| 2011 | 1 | 3 |
| 2012 | 1 | 0 |
| 2013 | 1 | 2 |
| 2014 | 0 | 2 |
| 2015 | 3 | 4 |
| 2016 | 2 | 5 |
| 2017 | 5 | 2 |
| 2018 | 4 | 3 |
| 2019 | 2 | 3 |
| 2020 | 1 | 3 |
| 2021 | 2 | 3 |
| 2022 | 2 | 2 |
| 2023 | 2 | 0 |
| 2024 | 0 | 1 |
| 2025 | 2 | 1 |
By publication year. Applications have been published since 2001.
Recent patents
- Deposition apparatus, method of deposition on a substrate, substrate structure and substrate support26 Aug 2025US 12,400,891 B2Applied Materials Italia S.R.L.
- Milling of flex foil with two conductive layers from both sides12 Aug 2025US 12,389,548 B2Dp Patterning AB
- Milling of flex foil with two conductive layers from both sides19 Dec 2023US 11,849,544 B2Gentherm Incorporated
- Unit unloading system18 Jul 2023US 11,706,875 B2Rokko Systems Pte Ltd
- Method for connecting stacked circuit boards25 Oct 2022US 11,483,938 B2Avary Holding (Shenzhen) Co., Limited.
- Method of producing printed circuit board and method of forming electro-conductive underlayer17 Apr 2025US 2025/0126721 A1Elephantech Inc.
- Method and Apparatus for Gripping Plurality of Types of Circuit Boards25 Jan 2024US 2024/0025669 A1Siemens Aktiengesellschaft
- Milling of flex foil with two conductive layers from both sides16 Jun 2022US 2022/0192028 A1Gentherm Incorporated
- Deposition apparatus, method of deposition on a substrate, substrate structure and substrate support19 May 2022US 2022/0157629 A1Applied Materials Italia S.R.L.
- Apparatus and method for manufacturing multilayer circuit boards8 Apr 2021US 2021/0105900 A1
Most cited
By later US patents
- Device for automatically populating a top and a bottom side of printed-circuit boards with SMD components38US 5,659,947 ABlaupunkt-Werke GmbH · 1997
- Conveyorized blind microvia laser drilling system37US 7,062,845 B2Laservia Corporation · 2006
- Fabrication of bi-level circuits22US 4,191,789 ABell Telephone Laboratories, Incorporated · 1980
- Hole masking apparatus19US 5,238,524 ANippon CMK Corp. · 1993
- Process of coating the surface of a board17US 4,600,601 AAisin Seiki Kabushiki Kaisha · 1986