H05K 2203/0548
Masks
H05K2203/0548 (Masks) appears on 836 US grants and 579 published applications in this corpus.
Search patents in H05K- Granted patents
- 836
- Published applications
- 579
- Assignees
- 390
- Inventors
- 1,660
- Latest grant
- 28 Jul 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 5 | 0 |
| 1977 | 6 | 0 |
| 1978 | 6 | 0 |
| 1979 | 2 | 0 |
| 1980 | 3 | 0 |
| 1981 | 6 | 0 |
| 1982 | 5 | 0 |
| 1983 | 11 | 0 |
| 1984 | 9 | 0 |
| 1985 | 11 | 0 |
| 1986 | 9 | 0 |
| 1987 | 17 | 0 |
| 1988 | 12 | 0 |
| 1989 | 11 | 0 |
| 1990 | 14 | 0 |
| 1991 | 13 | 0 |
| 1992 | 17 | 0 |
| 1993 | 16 | 0 |
| 1994 | 18 | 0 |
| 1995 | 21 | 0 |
| 1996 | 13 | 0 |
| 1997 | 25 | 0 |
| 1998 | 34 | 0 |
| 1999 | 25 | 0 |
| 2000 | 35 | 0 |
| 2001 | 39 | 15 |
| 2002 | 28 | 44 |
| 2003 | 39 | 29 |
| 2004 | 35 | 37 |
| 2005 | 25 | 23 |
| 2006 | 17 | 32 |
| 2007 | 10 | 40 |
| 2008 | 19 | 44 |
| 2009 | 25 | 49 |
| 2010 | 35 | 45 |
| 2011 | 30 | 18 |
| 2012 | 29 | 21 |
| 2013 | 23 | 12 |
| 2014 | 17 | 18 |
| 2015 | 9 | 16 |
| 2016 | 13 | 11 |
| 2017 | 15 | 22 |
| 2018 | 7 | 13 |
| 2019 | 20 | 10 |
| 2020 | 10 | 15 |
| 2021 | 10 | 8 |
| 2022 | 4 | 13 |
| 2023 | 6 | 13 |
| 2024 | 13 | 12 |
| 2025 | 10 | 12 |
| 2026 | 4 | 7 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Wiring board and manufacturing method therefor28 Jul 2026US 12,696,385 B2Toppan Holdings Inc.
- Photopolymer for anti-yellowing and anti-thermal cracking applications24 Mar 2026US 12,583,958 B2Nano and Advanced Materials Institute Limited
- Silver-based transparent conductive layers interfaced with copper traces and methods for forming the structures3 Mar 2026US 12,568,783 B2EKC Technology, Inc.
- Fabricating functional circuits on 3D freeform surfaces via intense pulsed light-induced zinc mass transfer17 Feb 2026US 12,557,223 B2The Penn State Research Foundation
- RF cover layer23 Dec 2025US 12,507,347 B2Raytheon Company
- Photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for producing printed wiring board2 Jul 2026US 2026/0186414 A1
- Methods for forming seed layer and plasma etching process2 Jul 2026US 2026/0190245 A1Absolics Inc.
- Hybrid mold, method for manufacturing hybrid mold, wiring structure, and method for manufacturing wiring structure30 Apr 2026US 2026/0122788 A1Panasonic Intellectual Property Management Co., Ltd.
- Manufacturing Component Carrier With Cavity by Trimming Poorly Adhesive Structure Before Removing Stack Material9 Apr 2026US 2026/0101448 A1AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Method for manufacturing master mold for imprinting29 Jan 2026US 2026/0027751 A1CONNECTEC JAPAN Corporation
Most cited
By later US patents
- Multilayer circuit board manufacturing278US 4,642,160 AInterconnect Technology Inc. · 1987
- Methods of forming channels and vias in insulating layers187US 5,173,442 AMicroelectronics and Computer Technology Corporation · 1992
- Manufacturing circuit board assemblies having filled vias171US 5,822,856 AInternational Business Machines Corporation · 1998
- Method of making components with solder balls162US 6,165,885 AInternational Business Machines Corporation · 2000
- Circuit wiring disposed on solder mask coating161US 4,706,167 ATelemark Co., Inc. · 1987