H05K 2203/0554
Metal used as mask for etching vias
Official title: Metal used as mask for etching vias, e.g. by laser ablation
H05K2203/0554 (Metal used as mask for etching vias) appears on 308 US grants and 220 published applications in this corpus.
Search patents in H05K- Granted patents
- 308
- Published applications
- 220
- Assignees
- 141
- Inventors
- 573
- Latest grant
- 23 Dec 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 1 | 0 |
| 1978 | 1 | 0 |
| 1979 | 1 | 0 |
| 1980 | 0 | 0 |
| 1981 | 1 | 0 |
| 1982 | 1 | 0 |
| 1983 | 2 | 0 |
| 1984 | 1 | 0 |
| 1985 | 3 | 0 |
| 1986 | 0 | 0 |
| 1987 | 5 | 0 |
| 1988 | 4 | 0 |
| 1989 | 5 | 0 |
| 1990 | 5 | 0 |
| 1991 | 5 | 0 |
| 1992 | 3 | 0 |
| 1993 | 5 | 0 |
| 1994 | 9 | 0 |
| 1995 | 9 | 0 |
| 1996 | 2 | 0 |
| 1997 | 11 | 0 |
| 1998 | 16 | 0 |
| 1999 | 8 | 0 |
| 2000 | 10 | 0 |
| 2001 | 17 | 6 |
| 2002 | 12 | 26 |
| 2003 | 17 | 20 |
| 2004 | 23 | 21 |
| 2005 | 13 | 10 |
| 2006 | 11 | 11 |
| 2007 | 4 | 17 |
| 2008 | 11 | 16 |
| 2009 | 7 | 9 |
| 2010 | 14 | 16 |
| 2011 | 10 | 9 |
| 2012 | 10 | 9 |
| 2013 | 11 | 5 |
| 2014 | 6 | 10 |
| 2015 | 4 | 3 |
| 2016 | 7 | 2 |
| 2017 | 3 | 2 |
| 2018 | 2 | 2 |
| 2019 | 4 | 3 |
| 2020 | 2 | 3 |
| 2021 | 1 | 1 |
| 2022 | 1 | 5 |
| 2023 | 4 | 4 |
| 2024 | 2 | 2 |
| 2025 | 3 | 3 |
| 2026 | 0 | 5 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Manufacturing component carrier with cavity by trimming poorly adhesive structure before removing stack material23 Dec 2025US 12,507,350 B2AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Manufacturing method of electronic device28 Oct 2025US 12,457,005 B2Innolux Corporation
- Method for manufacturing circuit board10 Jun 2025US 12,328,828 B2Unimicron Technology Corp.
- Technologies for power tunnels on circuit boards26 Nov 2024US 12,156,331 B2Intel Corporation
- Printed circuit board and method for manufacturing the same29 Oct 2024US 12,133,329 B2Samsung Electro-Mechanics Co., Ltd.
- Methods for forming seed layer and plasma etching process2 Jul 2026US 2026/0190245 A1Absolics Inc.
- Hybrid mold, method for manufacturing hybrid mold, wiring structure, and method for manufacturing wiring structure30 Apr 2026US 2026/0122788 A1Panasonic Intellectual Property Management Co., Ltd.
- Manufacturing Component Carrier With Cavity by Trimming Poorly Adhesive Structure Before Removing Stack Material9 Apr 2026US 2026/0101448 A1AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Printed circuit board manufacturing method and printed circuit board22 Jan 2026US 2026/0025926 A1Ruijie Networks Co., Ltd.
- Electronic device8 Jan 2026US 2026/0012221 A1Innolux Corporation
Most cited
By later US patents
- Multilayer circuit board manufacturing278US 4,642,160 AInterconnect Technology Inc. · 1987
- Methods of forming channels and vias in insulating layers187US 5,173,442 AMicroelectronics and Computer Technology Corporation · 1992
- Manufacturing circuit board assemblies having filled vias171US 5,822,856 AInternational Business Machines Corporation · 1998
- Method of manufacturing multilayer printed wiring board145US 5,826,330 AHitachi AIC Inc. · 1998
- Printed circuit board through hole technique143US 4,964,948 AProtoCAD, Inc. · 1990