Back to results
US 12,156,331 B2Granted
Technologies for power tunnels on circuit boards
AssigneeIntel Corporation
InventorsKhai Ern See, Jia Lin Liew, Tin Poay Chuah, Chee How Lim, Yi How Ooi
Life of this patent
Estimating the term…
Abstract
Techniques for power tunnels on circuit boards are disclosed. A power tunnel may be created in a circuit board by drilling through non-conductive layers to a conductive trace and then filling in the hole with a conductor. A power tunnel can have a high cross-sectional area and can carry a larger amount of current than an equivalent-width trace, reducing the area on a circuit board required to carry that amount of current.
Claims9
A circuit board comprising:
- a plurality of non-conductive layers defining a plane;
- a plurality of conductive traces, wherein each of the plurality of conductive traces is disposed between two non-conductive layers of the plurality of non-conductive layers;
- and
- a power tunnel extending through at least one of the plurality of non-conductive layers,
- wherein the power tunnel comprises a conductor to connect a battery of a device to a processor of the device,
- wherein the power tunnel extends along the plane defined by the plurality of non-conductive layers.
3 more elements
Dependencies are inferred from the claim text.