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US 12,133,329 B2Granted
Printed circuit board and method for manufacturing the same
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorSu Min Song
Life of this patent
Estimating the term…
Abstract
Provided are a printed circuit board and a method for manufacturing the same, the printed circuit board including: an insulating member; a first pad disposed in the insulating member; a plurality of first vias respectively disposed on a lower side of the first pad in the insulating member and connected to the first pad; and a second via disposed on an upper side of the first pad in the insulating member and connected to the first pad.
Claims16
A printed circuit board comprising:
- an insulating member;
- a first pad disposed in the insulating member;
- a plurality of first vias respectively disposed on a lower side of the first pad in the insulating member and connected to the first pad;
- a second via disposed on an upper side of the first pad in the insulating member and connected to the first pad;
- a plurality of second pads disposed on lower sides of the plurality of first vias in the insulating member and connected to the plurality of first vias;
- and
- one or more lines disposed on substantially the same level as the plurality of second pads in the insulating member and disposed between the plurality of second pads,
- wherein the first pad has one or more through-holes, and
- the plurality of first vias and the second via are integrated as one body through the one or more through-holes.
6 more elements
A printed circuit board comprising:
- an insulating member;
- a first pad disposed in the insulating member;
- a plurality of first vias, disposed in the insulating member, spaced apart from each other, and respectively disposed partially in and extending from the first pad;
- a second via disposed in the insulating member and extending from the first pad and also from the plurality of first vias in a direction away from the plurality of first vias;
- a plurality of second pads disposed on lower sides of the plurality of first vias in the insulating member and connected to the plurality of first vias;
- and
- one or more metal lines disposed on substantially the same level as the plurality of second pads in the insulating member and disposed between the plurality of second pads,
- wherein one of the plurality of first vias and the first pad have a boundary therebetween.
5 more elements
Dependencies are inferred from the claim text.