Photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for producing printed wiring board

Abstract

A photosensitive resin composition of one aspect of the present disclosure is a photosensitive resin composition containing a binder polymer, a photopolymerizable compound, a photopolymerization initiator, and a sensitizer, in which the binder polymer has a structural unit derived from an acrylic acid and a structural unit derived from styrene or a styrene derivative, and an absorbance of the photosensitive resin composition per 1 μm of thickness with respect to light having a wavelength of 365 nm is 0.0030 to 0.0120.

Dependencies are inferred from the claim text.