H05K 2203/0557
Non-printed masks
H05K2203/0557 (Non-printed masks) appears on 304 US grants and 245 published applications in this corpus.
Search patents in H05K- Granted patents
- 304
- Published applications
- 245
- Assignees
- 174
- Inventors
- 641
- Latest grant
- 17 Feb 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 1 | 0 |
| 1979 | 1 | 0 |
| 1980 | 0 | 0 |
| 1981 | 2 | 0 |
| 1982 | 1 | 0 |
| 1983 | 3 | 0 |
| 1984 | 2 | 0 |
| 1985 | 1 | 0 |
| 1986 | 1 | 0 |
| 1987 | 3 | 0 |
| 1988 | 4 | 0 |
| 1989 | 2 | 0 |
| 1990 | 1 | 0 |
| 1991 | 3 | 0 |
| 1992 | 5 | 0 |
| 1993 | 4 | 0 |
| 1994 | 1 | 0 |
| 1995 | 3 | 0 |
| 1996 | 5 | 0 |
| 1997 | 5 | 0 |
| 1998 | 11 | 0 |
| 1999 | 13 | 0 |
| 2000 | 21 | 0 |
| 2001 | 21 | 9 |
| 2002 | 12 | 12 |
| 2003 | 15 | 6 |
| 2004 | 12 | 14 |
| 2005 | 8 | 13 |
| 2006 | 6 | 15 |
| 2007 | 5 | 18 |
| 2008 | 7 | 26 |
| 2009 | 17 | 33 |
| 2010 | 17 | 19 |
| 2011 | 18 | 7 |
| 2012 | 13 | 8 |
| 2013 | 10 | 4 |
| 2014 | 7 | 4 |
| 2015 | 1 | 8 |
| 2016 | 3 | 3 |
| 2017 | 3 | 6 |
| 2018 | 1 | 5 |
| 2019 | 7 | 4 |
| 2020 | 6 | 6 |
| 2021 | 4 | 4 |
| 2022 | 1 | 2 |
| 2023 | 1 | 7 |
| 2024 | 7 | 7 |
| 2025 | 7 | 5 |
| 2026 | 1 | 0 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Fabricating functional circuits on 3D freeform surfaces via intense pulsed light-induced zinc mass transfer17 Feb 2026US 12,557,223 B2The Penn State Research Foundation
- RF cover layer23 Dec 2025US 12,507,347 B2Raytheon Company
- Antenna layer structures separated by fluid-filled cavity, an antenna inlay, and a component carrier2 Dec 2025US 12,489,205 B2AT&S Austria Technologies & Systemetechnik Aktiengesellschaft
- Printed wiring board9 Sep 2025US 12,414,231 B2Ibiden Co., Ltd.
- Multilayered nonpolar, chromium, copper material coatings of power electronics boards for thermal management24 Jun 2025US 12,342,449 B2The Board of Trustees of the University of Illinois
- Printed wiring board4 Dec 2025US 2025/0374425 A1Ibiden Co., Ltd.
- Device with laminated structure and method of manufacturing a laminated structure comprising dielectric layers24 Jul 2025US 2025/0240871 A1STMicroelectronics International N. V.
- Rf cover layer27 Mar 2025US 2025/0107006 A1Raytheon Company
- Drapable, flexible circuitry layers and methods therefor6 Feb 2025US 2025/0048559 A1LOOMIA Technologies, Inc.
- Component Carrier and Method for Manufacturing the Same Using a Desmear Process16 Jan 2025US 2025/0024611 A1AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
Most cited
By later US patents
- Method of making components with solder balls162US 6,165,885 AInternational Business Machines Corporation · 2000
- Method and apparatus for solder sphere placement using an air knife146US 5,431,332 AMotorola, Inc. · 1995
- Fine pitch solder deposits on printed circuit board process and product138US 5,492,266 AInternational Business Machines Corporation · 1996
- Method and apparatus for mounting a flexible film semiconductor chip carrier on a circuitized substrate122US 5,159,535 AInternational Business Machines Corporation · 1992
- Systems interconnected by bumps of joining material115US 6,759,738 B1International Business Machines Corporation · 2004