Multilayered nonpolar, chromium, copper material coatings of power electronics boards for thermal management

A method comprising:

• coating a power component and at least a portion of a printed circuit board (PCB) on which the power component is disposed with an electrical insulation layer comprising a non-polar compound;
• depositing, using one of thermal evaporation or sputtering, a chromium layer on the electrical insulation layer;
• depositing, using one of thermal evaporation or sputtering, a first copper layer on the chromium layer;
• depositing, using electroless deposition, a second copper layer on the first copper layer;
• and
• depositing, using copper electroplating, a third copper layer on the second copper layer.

A device comprising:

• a printed circuit board (PCB);
• a power source;
• power electronics disposed on the PCB that is to generate heat when powered by the power source;
• and
• a multilayered coating disposed over the power electronics and at least a portion of the PCB to dissipate the heat from the power electronics, the multilayered coating comprising:
• an electrical insulation layer comprising a non-polar compound and disposed on the power electronics and the at least a portion of the PCB;
• a chromium layer disposed on the electrical insulation layer;
• a thermally-evaporated copper layer deposited on the chromium layer;
• an electroless-deposited copper layer deposited on the thermally-evaporated copper layer;
• and
• an electroplated copper layer deposited on the electroless-deposited copper layer.