H05K 2203/0551
Exposure mask directly printed on the pcb
Official title: Exposure mask directly printed on the PCB
H05K2203/0551 (Exposure mask directly printed on the pcb) appears on 38 US grants and 35 published applications in this corpus.
Search patents in H05K- Granted patents
- 38
- Published applications
- 35
- Assignees
- 46
- Inventors
- 124
- Latest grant
- 24 Mar 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1983 | 1 | 0 |
| 1984 | 1 | 0 |
| 1985 | 0 | 0 |
| 1986 | 1 | 0 |
| 1987 | 1 | 0 |
| 1988 | 0 | 0 |
| 1989 | 1 | 0 |
| 1990 | 0 | 0 |
| 1991 | 2 | 0 |
| 1992 | 0 | 0 |
| 1993 | 2 | 0 |
| 1994 | 0 | 0 |
| 1995 | 3 | 0 |
| 1996 | 0 | 0 |
| 1997 | 1 | 0 |
| 1998 | 1 | 0 |
| 1999 | 2 | 0 |
| 2000 | 3 | 0 |
| 2001 | 0 | 0 |
| 2002 | 2 | 1 |
| 2003 | 1 | 1 |
| 2004 | 0 | 1 |
| 2005 | 1 | 0 |
| 2006 | 0 | 2 |
| 2007 | 0 | 2 |
| 2008 | 0 | 1 |
| 2009 | 0 | 4 |
| 2010 | 2 | 4 |
| 2011 | 1 | 2 |
| 2012 | 1 | 0 |
| 2013 | 1 | 0 |
| 2014 | 0 | 0 |
| 2015 | 2 | 1 |
| 2016 | 1 | 2 |
| 2017 | 2 | 2 |
| 2018 | 1 | 0 |
| 2019 | 0 | 0 |
| 2020 | 0 | 2 |
| 2021 | 0 | 0 |
| 2022 | 1 | 4 |
| 2023 | 1 | 2 |
| 2024 | 1 | 1 |
| 2025 | 0 | 1 |
| 2026 | 1 | 2 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Photopolymer for anti-yellowing and anti-thermal cracking applications24 Mar 2026US 12,583,958 B2Nano and Advanced Materials Institute Limited
- Substrate for pattern formation13 Feb 2024US 11,898,008 B2Daikin Industries, Ltd.
- Apparatus for use in preparing a printed circuit board and photosensitive ink for in an ink jet printer28 Feb 2023US 11,596,070 B2Orbotech Ltd.
- Solder mask inkjet inks for manufacturing printed circuit boards8 Nov 2022US 11,492,509 B2Agfa-Gevaert
- Support entering into the fabrication of an electronic device, corresponding memory card connector, memory card read terminal and manufacturing method22 May 2018US 9,980,374 B2Ingenico Group
- Photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for producing printed wiring board2 Jul 2026US 2026/0186414 A1
- Method for manufacturing master mold for imprinting29 Jan 2026US 2026/0027751 A1CONNECTEC JAPAN Corporation
- Interposer and method of forming the same7 Aug 2025US 2025/0251667 A1Hygon Information Technology Co., Ltd.
- Wiring substrate, manufacturing method thereof, light-emitting substrate, and display device26 Sep 2024US 2024/0322099 A1Boe Technology Group Co., Ltd.
- Method of Manufacturing Printed Circuit Boards25 May 2023US 2023/0159779 A1Agfa-Gevaert
Most cited
By later US patents
- Method for forming a cured resin coating having a desired pattern on the surface of a substrate34US 4,410,562 ADainippon Ink and Chemicals, Inc. · 1983
- Method for fabricating a multi-layer printed circuit board31US 5,377,404 A1995
- Multi-layer printed-wiring board process for producing26US 6,378,199 B1Dai Nippon Printing Co.Ltd. · 2002
- Photoimaging process23US 4,429,027 AE. I. Du Pont de Nemours and Company · 1984
- Method of patterning resist for printed wiring board23US 4,666,818 AThe Foxboro Company · 1987