Method for fabricating a multi-layer printed circuit board
OwnerN. Edward Berginventor
Life of this patent
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Abstract
A method for fabricating at least one via or hole in a multi-layer printed circuit board comprises separately drilling the board layers, stacking and laminating the drilled board layers utilizing conformal mapping digital imaging in a computer, and then finish drilling the holes. The invention also provides a method for correcting artwork to compensate for lamination distortion.
Claims11
A method of ensuring via or hole registration in a multi-layer printed circuit board comprising the steps in sequence of:
- (a) forming and drilling at least one hole in a first board layer in at least one preselected position;
- (b) illuminating at least a portion of a surface of said first board layer with light;
- (c) detecting light passing through said at least one hole in said first board layer and determining the actual position of said at least one hole;
- (d) generating in a computer a computer image representative of said first board layer having said at least one hole in said actual position;
- and,
- (e) automatically adjusting said preselected position, by conformal mapping digital imaging techniques in said computer, so that said preselected position conforms to said actual position and using said adjusted preselected position to permit automatic formation and drilling of a next board layer without using a physical template.
A method of correcting for the effects of lamination distortion in the production of a multi-layer printed circuit board comprising the steps in sequence, of:
- (a) forming a first board layer having at least one fiducial mark in a preselected position;
- (b) subjecting said first board layer to laminating conditions;
- (c) illuminating at least a portion of a surface of said first board layer with light;
- (d) detecting light passing through or reflected from the illuminated surface of said first board and determining the actual position of said at least one fiducial mark;
- generating in a computer a computer image representative of said first board layer having said at least one mark in said actual position and determining any distortion to said first board layer that has occurred as a result of said laminating conditions;
- and
- (e) automatically adjusting formation of a next board layer by conforming said preselected position to said actual position by using conformal mapping techniques and accounting for said distortion, without using a physical template.
Dependencies are inferred from the claim text.