Wiring substrate, manufacturing method thereof, light-emitting substrate, and display device

A method of manufacturing a wiring substrate comprising:

• providing a base substrate comprising a functional region and a bonding region;
• applying a first conductive film on the base substrate, patterning the first conductive film through a first mask to form a first conductive layer which is at least in the functional region;
• applying a second conductive film on a side of the first conductive layer away from the base substrate, patterning the second conductive film through a second mask to form a second conductive layer which is at least in the functional region and electrically connected to the first conductive layer;
• and
• applying a first insulating film on a side of the second conductive layer away from the base substrate, patterning the first insulating film through a third mask to form a first insulating layer comprising a main part and an opening,
• wherein at least one of the first conductive layer and the second conductive layer comprises a plurality of electrodes in the bonding region and extending along a first direction, each of the plurality of electrodes comprises a first end adjacent to the functional region in the first direction- and an orthographic projection of the main part of the first insulating layer on the base substrate at least partially overlaps with an orthographic projection of the first end of each electrode on the base substrate.