H05K 2203/056
Using an artwork, i.e. a photomask for exposing photosensitive layers
H05K2203/056 (Using an artwork, i.e. a photomask for exposing photosensitive layers) appears on 180 US grants and 57 published applications in this corpus.
Search patents in H05K- Granted patents
- 180
- Published applications
- 57
- Assignees
- 113
- Inventors
- 316
- Latest grant
- 29 Oct 2024
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 4 | 0 |
| 1977 | 4 | 0 |
| 1978 | 4 | 0 |
| 1979 | 0 | 0 |
| 1980 | 3 | 0 |
| 1981 | 4 | 0 |
| 1982 | 4 | 0 |
| 1983 | 5 | 0 |
| 1984 | 5 | 0 |
| 1985 | 7 | 0 |
| 1986 | 7 | 0 |
| 1987 | 8 | 0 |
| 1988 | 4 | 0 |
| 1989 | 3 | 0 |
| 1990 | 8 | 0 |
| 1991 | 4 | 0 |
| 1992 | 9 | 0 |
| 1993 | 5 | 0 |
| 1994 | 8 | 0 |
| 1995 | 6 | 0 |
| 1996 | 6 | 0 |
| 1997 | 8 | 0 |
| 1998 | 7 | 0 |
| 1999 | 2 | 0 |
| 2000 | 2 | 0 |
| 2001 | 4 | 1 |
| 2002 | 2 | 5 |
| 2003 | 7 | 2 |
| 2004 | 0 | 2 |
| 2005 | 3 | 0 |
| 2006 | 1 | 4 |
| 2007 | 1 | 4 |
| 2008 | 1 | 1 |
| 2009 | 1 | 6 |
| 2010 | 2 | 7 |
| 2011 | 2 | 0 |
| 2012 | 6 | 4 |
| 2013 | 2 | 3 |
| 2014 | 4 | 2 |
| 2015 | 0 | 1 |
| 2016 | 2 | 2 |
| 2017 | 1 | 4 |
| 2018 | 2 | 2 |
| 2019 | 4 | 0 |
| 2020 | 3 | 4 |
| 2021 | 3 | 1 |
| 2022 | 0 | 1 |
| 2023 | 0 | 0 |
| 2024 | 2 | 1 |
By publication year. Applications have been published since 2001.
Recent patents
- Optically functional multilayer structure and related method of manufacture29 Oct 2024US 12,130,005 B2Tactotek Oy
- Photosensitive element, resin composition for forming barrier layer, method for forming resist pattern, and method for manufacturing printed wiring board16 Apr 2024US 11,960,208 B2Resonac Corporation
- Thermally expandable material, sheet material, circuit board, method for manufacturing circuit board, computer readable storage medium, electronic apparatus, and structure to analyze heat-generation position19 Jan 2021US 10,897,817 B2Casio Computer Co., Ltd.
- Microcapsule, sheet material, circuit board, method for manufacturing circuit board, and computer readable storage medium12 Jan 2021US 10,893,607 B2Casio Computer Co., Ltd.
- Method for manufacturing flexible printed circuit board (FPCB) and apparatus for manufacturing FPCB5 Jan 2021US 10,887,997 B2Inktec Co., Ltd.
- Optically functional multilayer structure and related method of manufacture4 Jan 2024US 2024/0003516 A1Tactotek Oy
- Technologies for aligned vias over multiple layers22 Dec 2022US 2022/0406618 A1Intel Corporation
- Photosensitive element, resin composition for forming barrier layer, method for forming resist pattern, and method for manufacturing printed wiring board16 Sep 2021US 2021/0286265 A1Showa Denko Materials Co., Ltd.
- Circuit board interconnect decals23 Jul 2020US 2020/0236788 A1Honeywell Federal Manufacturing & Technologies, LLC
- Microcapsule, sheet material, circuit board, method for manufacturing circuit board, and computer readable storage medium2 Jul 2020US 2020/0214125 A1Casio Computer Co., Ltd.
Most cited
By later US patents
- Circuit wiring disposed on solder mask coating161US 4,706,167 ATelemark Co., Inc. · 1987
- Blind via laser drilling system115US 6,211,485 B12001
- Method of laser drilling fluoropolymer materials93US 4,915,981 ARogers Corporation · 1990
- Blind via laser drilling system91US 6,631,558 B2Laservia Corporation · 2003
- Liquid crystal display module having housing of C-shaped cross section86US 4,958,911 AJonand, Inc. · 1990