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US 2021/0286265 A1Published application
Photosensitive element, resin composition for forming barrier layer, method for forming resist pattern, and method for manufacturing printed wiring board
AssigneeShowa Denko Materials Co., Ltd.
InventorsMasakazu KUME, Hiroshi ONO
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Abstract
A photosensitive element comprising a support film, a barrier layer, and a photosensitive layer in this order, wherein the barrier layer contains a water-soluble resin and an ultraviolet absorber.
Claims18
A photosensitive element comprising:
- a support film,
- a barrier layer, and
- a photosensitive layer in this order,
- wherein the barrier layer contains a water-soluble resin, and an ultraviolet absorber.
1 more element
A resin composition for forming a barrier layer, comprising:
- a water-soluble resin;
- an ultraviolet absorber;
- and
- water.
1 more element
Dependencies are inferred from the claim text.