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US 11,960,208 B2Granted
Photosensitive element, resin composition for forming barrier layer, method for forming resist pattern, and method for manufacturing printed wiring board
AssigneeResonac Corporation
InventorsMasakazu Kume, Hiroshi Ono
Life of this patent
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Abstract
A photosensitive element comprising a support film, a barrier layer, and a photosensitive layer in this order, wherein the barrier layer contains a water-soluble resin and an ultraviolet absorber.
Claims13
A photosensitive element comprising:
- a support film,
- a barrier layer, and
- a photosensitive layer in this order,
- wherein the barrier layer contains a water-soluble resin, and an ultraviolet absorber,
- wherein the ultraviolet absorber contains a compound represented by the following formula (1):
- and wherein the content of the ultraviolet absorber in the barrier layer is from 0.01% to 4.0% by mass based on the total amount of the barrier layer.
3 more elements
Dependencies are inferred from the claim text.