Technologies for aligned vias over multiple layers

A method comprising:

• applying a first layer to a substrate, wherein the first layer comprises a photoimageable dielectric (PID) material;
• applying a second layer to the first layer, wherein the second layer comprises a PID material or a photoresist material;
• applying a third layer to the second layer, wherein the third layer comprises a photoresist material;
• exposing the first layer, the second layer, and the third layer with electromagnetic radiation with use of a multi-tone photomask, wherein the electromagnetic radiation through one or more light gray regions of the multi-tone photomask exposes two but not three of the first layer, second layer, and third layer, and wherein the electromagnetic radiation through one or more dark gray regions of the multi-tone photomask exposes only one of the first layer, second layer, and third layer;
• developing the first layer, the second layer, and the third layer, wherein the developed first layer defines a first mold with a first via region, wherein the developed second layer defines a second mold with a conductive trace region and a second via region,
• wherein the developed third layer comprises an overhang region that extends over the second via region;
• filling the mold defined by the first layer and the mold defined by the second layer with a conductive infill;
• and
• applying an etchant to the conductive infill, wherein the etchant etches the conductive infill from a top surface of the conductive infill to create a conductive trace in the conductive trace region, wherein the etchant laterally etches the conductive infill under the overhang region to create a via in the second via region, wherein the etched conductive infill comprises a first via in the first via region, a conductive trace in the conductive trace region, and a second via in the second via region.