Thermally expandable material, sheet material, circuit board, method for manufacturing circuit board, computer readable storage medium, electronic apparatus, and structure to analyze heat-generation position
AssigneeCasio Computer Co., Ltd.
InventorsKenji Iwamoto, Satoshi Kurosawa
Life of this patent
Estimating the term…
Abstract
A thermally expandable material includes microcapsules and a binder having a conducting property, each microcapsule including a shell having an insulating property, and a thermally expandable component contained in the shell and having a property of expanding by heating, the shell deforming due to expansion of the thermally expandable component to come in contact with another capsule and have an insulating state with the other capsule.
Claims8
A thermally expandable material, comprising:
- microcapsules;
- and
- a binder having an electric conducting property,
- wherein:
- each microcapsule includes a shell having an insulating property, and a thermally expandable component contained in the shell and having a property of expanding by heating, and
- the shell deforms due to expansion of the thermally expandable component to come in contact with another microcapsule and have an insulating state with the another microcapsule.
A sheet material, comprising:
- a base layer;
- and
- a thermally expandable layer disposed on the base layer,
- the thermally expandable layer including microcapsules and a binder having an electric conducting property,
- wherein:
- each microcapsule includes a shell having an insulating property, and a thermally expandable component contained in the shell and having a property of expanding by heating, and
- the shell defines an insulating region due to expansion of the thermally expandable component.
An electronic apparatus having an electrically conductive binder through which an electric current flows, and comprising microcapsules disposed within the binder, each microcapsule including a shell having an insulating property, and a thermally expandable component contained in the shell and having a property of expanding by heating,
- the electronic apparatus being configured such that, in case of an unexpected short-circuit, the microcapsules expand due to heat generated from the short-circuit so as to insulate a part around the short-circuit.
A structure to analyze a heat-generation position, comprising a plurality of microcapsules disposed at positions within an electrically conductive binder of a product, each microcapsule including a shell having an insulating property, and a thermally expandable component contained in the shell and having a property of expanding by heating,
- the structure being configured to allow analysis of an expanding region, if any, of the microcapsules so as to enable analysis of an unexpected heat-generation position of the product.
Dependencies are inferred from the claim text.