Method of laser drilling fluoropolymer materials
AssigneeRogers Corporation
InventorsRichard T. Traskos, Cathy A. Fleischer, Carlos L. Barton, David B. Noddin
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Abstract
A method of ablating fluoropolymer composite materials is presented wherein it has been found that small holes (less than 100 .mu.m) can be formed in fluoropolymer composite laminate materials using UV lasers. The resulting holes can be used to produce vias and plated through-holes having smooth side walls with little or no debris or residue remaining in the holes and minimal damage to the polymer. Thus, the vias and plated through-holes can be plated without further cleaning processes. In addition, the holes are formed at a relatively fast rate.
Claims16
A method of forming a hole through a substrate comprised of a composite, the composite including fluoropolymeric matrix material which is substantially transparent to ultraviolet radiation and at least one filler material disposed within said fluoropolymeric matrix material, the filler material interacting with said fluoropolymeric matrix material so as to render said composite absorptive to ultraviolet radiation wherein said composite defines a filled fluoropolymeric composite, the substrate further having opposed first and second surfaces, comprising the step of:
- delivering ultraviolet radiation onto said first surface of said filled fluoropolymer composite substrate for sufficient time to ablate said composite and form a hole wherein said substrate is progressively ablated from said first surface to said opposed second surface.
Dependencies are inferred from the claim text.