H05K 2203/0147
Carriers and holders
H05K2203/0147 (Carriers and holders) appears on 1,290 US grants and 1,356 published applications in this corpus.
Search patents in H05K- Granted patents
- 1,290
- Published applications
- 1,356
- Assignees
- 638
- Inventors
- 3,020
- Latest grant
- 1 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 8 | 0 |
| 1977 | 3 | 0 |
| 1978 | 4 | 0 |
| 1979 | 2 | 0 |
| 1980 | 2 | 0 |
| 1981 | 4 | 0 |
| 1982 | 8 | 0 |
| 1983 | 8 | 0 |
| 1984 | 6 | 0 |
| 1985 | 9 | 0 |
| 1986 | 8 | 0 |
| 1987 | 16 | 0 |
| 1988 | 6 | 0 |
| 1989 | 17 | 0 |
| 1990 | 15 | 0 |
| 1991 | 20 | 0 |
| 1992 | 19 | 0 |
| 1993 | 14 | 0 |
| 1994 | 23 | 0 |
| 1995 | 13 | 0 |
| 1996 | 12 | 0 |
| 1997 | 15 | 0 |
| 1998 | 29 | 0 |
| 1999 | 31 | 0 |
| 2000 | 29 | 0 |
| 2001 | 43 | 18 |
| 2002 | 25 | 44 |
| 2003 | 30 | 35 |
| 2004 | 42 | 57 |
| 2005 | 30 | 49 |
| 2006 | 27 | 76 |
| 2007 | 37 | 66 |
| 2008 | 42 | 84 |
| 2009 | 40 | 100 |
| 2010 | 49 | 64 |
| 2011 | 51 | 52 |
| 2012 | 54 | 48 |
| 2013 | 53 | 32 |
| 2014 | 33 | 49 |
| 2015 | 38 | 61 |
| 2016 | 42 | 41 |
| 2017 | 35 | 46 |
| 2018 | 36 | 46 |
| 2019 | 39 | 43 |
| 2020 | 41 | 53 |
| 2021 | 49 | 55 |
| 2022 | 32 | 37 |
| 2023 | 25 | 32 |
| 2024 | 38 | 37 |
| 2025 | 25 | 19 |
| 2026 | 13 | 112 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
- H05K 2203/0152Temporary metallic carrierIndexing code376
- H05K 2203/0156Temporary polymeric carrier or foilIndexing code372
- H05K 2203/016Temporary inorganic, non-metallic carrierIndexing code241
- H05K 2203/0165Holder for holding a printed circuit board [pcb] during processingIndexing code228
- H05K 2203/0169Using a temporary frame during processingIndexing code105
- H05K 2203/0173Template for holding a pcb having mounted components thereonIndexing code71
Recent patents
- Method for manufacturing printed circuit boards1 Sep 2026US 12,727,090 B2Gebr. Schmid GmbH & Co.
- Wiring substrate, method of trimming same, and multi-layered wiring board4 Aug 2026US 12,701,662 B2Mitsui Kinzoku Company, Limited
- Method for manufacturing a multilayer circuit board14 Jul 2026US 12,684,698 B2Avary Holding (Shenzhen) Co., Limited.
- Method of manufacturing semiconductor device and jig set16 Jun 2026US 12,654,263 B2Fuji Electric Co., Ltd.
- Base board floating arm16 Jun 2026US 12,660,092 B2Sheng Chuan Technology Co., Ltd.
- Circuit board processing equipment8 Oct 2026US 2026/0313808 A1Wistron Corporation
- Semiconductor package warpage and alignment management17 Sep 2026US 2026/0282241 A1Arm Limited
- Printed circuit board and manufacturing method thereof27 Aug 2026US 2026/0255479 A1Samsung Electro-Mechanics Co., Ltd.
- Straddle-mount connector rework27 Aug 2026US 2026/0255496 A1International Business Machines Corporation
- Element transfer device and method for controlling the same27 Aug 2026US 2026/0255499 A1Chungang University Industry Academic Cooperation Foundation
Most cited
By later US patents
- Thin film electrical component781US 5,108,819 AEli Lilly and Company · 1992
- Method of making a thin film electrical component396US 5,403,700 AEli Lilly and Company · 1995
- High-density, multi-level interconnects, flex circuits, and tape for tab285US 5,106,461 AMassachusetts Institute of Technology · 1992
- Process for forming solder balls on a plate having apertures using solder paste and transferring the solder balls to semiconductor device207US 5,643,831 AFujitsu Limited · 1997
- Embedded 3D interposer structure183US 8,426,961 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2013