H05K 2203/016
Temporary inorganic, non-metallic carrier
Official title: Temporary inorganic, non-metallic carrier, e.g. for processing or transferring
H05K2203/016 (Temporary inorganic, non-metallic carrier) appears on 241 US grants and 358 published applications in this corpus.
Search patents in H05K- Granted patents
- 241
- Published applications
- 358
- Assignees
- 144
- Inventors
- 591
- Latest grant
- 4 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 3 | 0 |
| 1988 | 0 | 0 |
| 1989 | 1 | 0 |
| 1990 | 2 | 0 |
| 1991 | 0 | 0 |
| 1992 | 3 | 0 |
| 1993 | 1 | 0 |
| 1994 | 0 | 0 |
| 1995 | 3 | 0 |
| 1996 | 1 | 0 |
| 1997 | 4 | 0 |
| 1998 | 0 | 0 |
| 1999 | 5 | 0 |
| 2000 | 5 | 0 |
| 2001 | 6 | 3 |
| 2002 | 4 | 1 |
| 2003 | 2 | 9 |
| 2004 | 8 | 13 |
| 2005 | 5 | 8 |
| 2006 | 4 | 24 |
| 2007 | 9 | 20 |
| 2008 | 15 | 25 |
| 2009 | 14 | 20 |
| 2010 | 11 | 13 |
| 2011 | 14 | 8 |
| 2012 | 8 | 9 |
| 2013 | 15 | 8 |
| 2014 | 9 | 10 |
| 2015 | 10 | 10 |
| 2016 | 7 | 12 |
| 2017 | 9 | 5 |
| 2018 | 9 | 9 |
| 2019 | 9 | 9 |
| 2020 | 7 | 10 |
| 2021 | 10 | 10 |
| 2022 | 4 | 7 |
| 2023 | 6 | 11 |
| 2024 | 6 | 6 |
| 2025 | 9 | 4 |
| 2026 | 2 | 94 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Wiring substrate, method of trimming same, and multi-layered wiring board4 Aug 2026US 12,701,662 B2Mitsui Kinzoku Company, Limited
- Method of using an organizer for manufacture of electronic device with cabled interconnects6 Jan 2026US 12,519,277 B2Amphenol Corporation
- Plurality of build-up layers in a circuit board structure7 Oct 2025US 12,439,529 B2Unimicron Technology Corp.
- Composite layer circuit element23 Sep 2025US 12,424,454 B2Innolux Corporation
- Lighting element alignment2 Sep 2025US 12,408,482 B2Lumileds LLC
- Simultaneous Silicon Spring and Chip Singulation DRIE13 Aug 2026US 2026/0239987 A1
- High Current Column Grid Array Pillars13 Aug 2026US 2026/0240010 A1
- Targeted Jet-Cooling System for Zetta-Scale Computing Assemblies16 Jul 2026US 2026/0202891 A1
- Local-Bias Adaptive Drive for Timing Stabilization in Pipelined Mixed-Precision Processing Elements16 Jul 2026US 2026/0203017 A1
- Pipelined Fused Multiply-Add Processing Element for FP4 Weight and FP8 Activation Arithmetic with FP8 Accumulation16 Jul 2026US 2026/0203018 A1
Most cited
By later US patents
- Thin film electrical component781US 5,108,819 AEli Lilly and Company · 1992
- Method of making a thin film electrical component396US 5,403,700 AEli Lilly and Company · 1995
- High-density, multi-level interconnects, flex circuits, and tape for tab285US 5,106,461 AMassachusetts Institute of Technology · 1992
- Process for forming solder balls on a plate having apertures using solder paste and transferring the solder balls to semiconductor device207US 5,643,831 AFujitsu Limited · 1997
- Embedded 3D interposer structure183US 8,426,961 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2013