H05K 2203/01
Tools for processing
Official title: Tools for processing; Objects used during processing
H05K2203/01 (Tools for processing) appears on 4,304 US grants and 4,431 published applications in this corpus.
Search patents in H05K- Granted patents
- 4,304
- Published applications
- 4,431
- Assignees
- 1,613
- Inventors
- 9,183
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 15 | 0 |
| 1977 | 8 | 0 |
| 1978 | 11 | 0 |
| 1979 | 9 | 0 |
| 1980 | 13 | 0 |
| 1981 | 11 | 0 |
| 1982 | 19 | 0 |
| 1983 | 19 | 0 |
| 1984 | 22 | 0 |
| 1985 | 31 | 0 |
| 1986 | 35 | 0 |
| 1987 | 44 | 0 |
| 1988 | 29 | 0 |
| 1989 | 52 | 0 |
| 1990 | 50 | 0 |
| 1991 | 55 | 0 |
| 1992 | 60 | 0 |
| 1993 | 70 | 0 |
| 1994 | 62 | 0 |
| 1995 | 56 | 0 |
| 1996 | 54 | 0 |
| 1997 | 60 | 0 |
| 1998 | 105 | 0 |
| 1999 | 110 | 0 |
| 2000 | 127 | 0 |
| 2001 | 141 | 76 |
| 2002 | 121 | 144 |
| 2003 | 123 | 137 |
| 2004 | 132 | 218 |
| 2005 | 103 | 288 |
| 2006 | 110 | 303 |
| 2007 | 131 | 301 |
| 2008 | 133 | 302 |
| 2009 | 149 | 342 |
| 2010 | 197 | 245 |
| 2011 | 187 | 157 |
| 2012 | 178 | 143 |
| 2013 | 123 | 105 |
| 2014 | 104 | 160 |
| 2015 | 121 | 192 |
| 2016 | 145 | 145 |
| 2017 | 122 | 121 |
| 2018 | 114 | 139 |
| 2019 | 109 | 130 |
| 2020 | 127 | 138 |
| 2021 | 126 | 141 |
| 2022 | 94 | 88 |
| 2023 | 79 | 96 |
| 2024 | 91 | 104 |
| 2025 | 74 | 65 |
| 2026 | 43 | 151 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
- H05K 2203/0104For patterning or coatingIndexing code2,047
- H05K 2203/0147Carriers and holdersIndexing code1,290
- H05K 2203/0195Tool for a process not provided for in h05k3/00Indexing code726
- H05K 2203/0191Using tape or non-metallic foil in a processIndexing code418
- H05K 2203/0182Using a temporary spacer element or stand-off during processingIndexing code45
- H05K 2203/0186Mask formed or laid on pcb, the mask having recesses or openingsIndexing code32
- H05K 2203/0178ProjectileIndexing code2
Recent patents
- Sealed squeegee for supplying solder paste with uniform density6 Oct 2026US 12,752,358 B2Ese Co., Ltd.
- Tape processing method6 Oct 2026US 12,757,333 B2Chipbond Technology Corporation
- Dispenser and lifting device of dispenser1 Sep 2026US 12,727,089 B2Illinois Tool Works Inc.
- Method for manufacturing printed circuit boards1 Sep 2026US 12,727,090 B2Gebr. Schmid GmbH & Co.
- Press-in machine for pressing components into a substrate, in particular into a printed circuit board or carrier plate, with substrate positioning11 Aug 2026US 12,707,617 B2ERSA GmbH
- Circuit board processing equipment8 Oct 2026US 2026/0313808 A1Wistron Corporation
- Conductive film forming apparatus and conductive film forming method1 Oct 2026US 2026/0304637 A1Shibaura Mechatronics Corporation
- Circuit forming method and circuit forming apparatus1 Oct 2026US 2026/0304641 A1Fuji Corporation
- Semiconductor package warpage and alignment management17 Sep 2026US 2026/0282241 A1Arm Limited
- Component covers inhibiting dynamic component warping during reflow10 Sep 2026US 2026/0271194 A1International Business Machines Corporation
Most cited
By later US patents
- Three-dimensional printing techniques1,084US 5,204,055 AMassachusetts Institute of Technology · 1993
- Thin film electrical component781US 5,108,819 AEli Lilly and Company · 1992
- Three-dimensional printing techniques723US 5,387,380 AMassachusetts Institute of Technology · 1995
- Component crimping apparatus control method, component crimping apparatus, and measuring tool472US 8,078,310 B2Panasonic Corporation · 2011
- Method of making a thin film electrical component396US 5,403,700 AEli Lilly and Company · 1995