H05K 2203/0182
Using a temporary spacer element or stand-off during processing
H05K2203/0182 (Using a temporary spacer element or stand-off during processing) appears on 45 US grants and 48 published applications in this corpus.
Search patents in H05K- Granted patents
- 45
- Published applications
- 48
- Assignees
- 38
- Inventors
- 101
- Latest grant
- 5 May 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1986 | 1 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 1 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 1 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 1 | 0 |
| 1999 | 1 | 0 |
| 2000 | 0 | 0 |
| 2001 | 2 | 1 |
| 2002 | 0 | 8 |
| 2003 | 2 | 5 |
| 2004 | 6 | 2 |
| 2005 | 6 | 5 |
| 2006 | 2 | 1 |
| 2007 | 2 | 2 |
| 2008 | 2 | 4 |
| 2009 | 3 | 1 |
| 2010 | 1 | 0 |
| 2011 | 0 | 2 |
| 2012 | 1 | 1 |
| 2013 | 1 | 0 |
| 2014 | 0 | 1 |
| 2015 | 0 | 2 |
| 2016 | 0 | 1 |
| 2017 | 1 | 1 |
| 2018 | 1 | 0 |
| 2019 | 1 | 4 |
| 2020 | 1 | 0 |
| 2021 | 0 | 0 |
| 2022 | 2 | 4 |
| 2023 | 2 | 1 |
| 2024 | 3 | 1 |
| 2025 | 0 | 0 |
| 2026 | 1 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
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- Component, positioning device and method for fastening the component by soldering27 Jun 2023US 11,688,989 B2Phoenix Contact GmbH & Co.KG
- Electrical circuit forming method and electrical circuit forming device20 Aug 2026US 2026/0247540 A1Fuji Corporation
- Method of manufacturing the printed circuit board embedded with wafer level component29 Aug 2024US 2024/0292544 A1Daeduck Electronics Co., Ltd.
- Printed circuit board, battery module, battery pack, and electrical device29 Jun 2023US 2023/0207897 A1Contemporary Amperex Technology Co., Limited
- Layered device for pressure treatment and method1 Dec 2022US 2022/0386474 A1Canatu Oy
- Electric circuit module and manufacturing method thereof25 Aug 2022US 2022/0272842 A1TDK Corporation
Most cited
By later US patents
- Using a supporting structure to control collapse of a die towards a die pad during a reflow process for coupling the die to the die pad73US 6,849,944 B2Texas Instruments Incorporated · 2005
- Solder ball placement fixtures and methods56US 6,253,992 B1Tessera, Inc. · 2001
- Solder bump stretch device36US 5,148,968 AMotorola, Inc. · 1992
- Multi-level thin-film electronic packaging structure and related method29US 6,281,452 B1International Business Machines Corporation · 2001
- Process for forming a multi-level thin-film electronic packaging structure12US 6,678,949 B2International Business Machines Corporation · 2004