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AssigneeInternational Business Machines Corporation
InventorsChandrika Prasad, Roy Yu, Richard L. Canull, Giulio DiGiacomo, Ajay P. Giri, Lewis S. Goldmann, Kimberley A. Kelly, Bouwe W. Leenstra, Voya R. Markovich, Eric D. Perfecto, Sampath Purushothaman, Joseph M. Sullivan
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A structure for mounting electronic devices. The structure uses a non-conductive, compliant spacer interposed between an underlying carrier and an overlying thin film. The spacer includes a pattern of through-vias which matches opposing interconnects on opposing surfaces of the carrier and the thin film. In this way, solder connections can extend in the through-vias to electrically connect the thin film to the carrier and smooth out topography. In a related process for forming the structure, the thin film is built on a first sacrificial carrier and then further processed on a second sacrificial carrier to keep it from distorting, expanding, or otherwise suffering adversely during its processing. The solder connections between the thin film and the carrier are formed using a closed solder joining process. The spacer is used with laminate cards to create thermal stress release structures on portions of the cards carrying a thin film.
In a process for forming a structure upon which electronic devices can be mounted, in which process a multi-layer thin film is built and carried on a first sacrificial carrier and a multi-level ceramic substrate is patterned with lines, vias, and an array of contacts, the improvement comprising the steps of:
A process for forming a structure suitable for mounting electronic devices thereon, the process comprising the steps of:
Dependencies are inferred from the claim text.