Pressure sintering device and method for manufacturing an electronic component
AssigneeDanfoss Silicon Power GmbH
InventorsMartin Becker, Dirk Dittmann
Life of this patent
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Abstract
A method for manufacturing an electronic component by a pressure-assisted low-temperature sintering process, by using a pressure sintering device having an upper die and a lower die is disclosed. The upper the die and/or the lower die is provided with a first pressure pad, wherein the method includes the following steps: placing a first sinterable component on a first sintering layer provided on a top layer of a first substrate; joining the sinterable component and the top layer of the first substrate to form a first electronic component by pressing the upper die and the lower die towards each other, wherein the sintering device is simultaneously heated.
Claims23
A method for manufacturing an electronic component by a pressure-assisted low-temperature sintering process, by using a pressure sintering device having an upper die and a lower die, wherein the upper die and/or the lower die is provided with a first pressure pad, wherein the method comprises the following steps:
- placing a first sinterable component on a first sintering layer provided on a top layer of a first substrate to provide a first formable electronic component;
- joining the first sinterable component and the top layer of the first substrate to form a first electronic component by pressing the upper die and the lower die towards each other, wherein the pressure sintering device is simultaneously heated;
- wherein that the method applies the following steps before the upper die and the lower die are pressed towards each other:
- placing, in a level above the first formable electronic component or below the first formable electronic component, a second formable electronic component comprising at least a second sinterable component on a second sintering layer provided on a top layer of a second substrate;
- placing a second pressure pad between the first formable electronic component and the second formable electronic component.
A pressure sintering device for manufacturing an electronic component via a pressure-assisted low-temperature sintering process, wherein the pressure sintering device comprises:
- an upper die and a lower die arranged to be moved relative to each other, wherein upper die and/or the lower die is provided with a first pressure pad, wherein the pressure sintering device is configured to heat and pressurise an electronic component arranged between the upper die and a lower die, wherein the pressure sintering device comprises at least one additional pressure pad being arranged to separate a first electronic component from a second electronic component when the first electronic component and the second electronic component are arranged between the upper die and a lower die.
Dependencies are inferred from the claim text.