Solder bump stretch device

A solder bump stretch device for use in combination with an electronic component and a substrate for attaching the component to the substrate by reflowed solder bump interconnections, said component comprising an outer face opposite the substrate, said device being actuated during solder reflow to lift the component relative to the substrate to thereby form interconnections having an elongated configuration, said device comprising

• a web comprising a web section and a flexible strip extending from the section,
• means for fastening the web to the component to fix the web section against the component outer face,
• a leg connected to the strip remote from the web section to depend about the component for engaging the substrate, and
• a lift bar operatively connected to the leg and having a section overlying the web section, said bar being moveable between a raised position wherein the bar section is spaced apart from the web section for receiving an expendable spacer therebetween and said strip is flexed to raise the leg relative to the substrate, and a lowered position wherein the strip extends adjacent the component outer face to lower the leg for engagement to the substrate.

A solder bump stretch device for use in combination with an electronic component and a substrate for attaching the component to the substrate by reflowed solder bump interconnections, said component comprising an outer face opposite the substrate, said device being actuated during solder reflow to lift the component relative to the substrate and thereby from interconnections having an elongated configuration, said device comprising

• a web comprising a section and a flexible strip extending from the section and having end remote from the section,
• means for fastening the web to the component to fix the section to the component outer face such that the strip overlies the component outer face with the strip end extending about the component and is flexible between a relaxed position wherein the strip lies adjacent the component outer face and a biased position wherein the strip is bowed from the section to raise the end relative to the component outer face,
• a leg dependent from said strip end and sized to engage the substrate when the strip is in the relaxed position, and
• expendable spacer means for supporting the strip in the biased position, said means being expendable at solder reflow temperature to release the strip to the relaxed position to engage said leg to the substrate to lift the component and thereby to stretch the solder configurations.