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US 11,979,988 B2Granted
Electric circuit module and manufacturing method thereof
AssigneeTDK Corporation
InventorsShuichi Takizawa, Atsushi Yoshino, Yuki Okino, Hiromu Harada
Life of this patent
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Abstract
Disclosed herein is an electric circuit module that includes a circuit board, an electronic component mounted on an upper surface of the circuit board, and a mold member that covers the upper and side surfaces of the circuit board. The lower area of the side surface of the circuit board is exposed so as not to be covered with the mold member.
Claims7
An electronic circuit module comprising:
- a first circuit board having a plurality of terminal electrodes on a lower surface thereof;
- an electronic component mounted on an upper surface of the first circuit board positioned on a side opposite to the lower surface;
- first mold member that covers the upper surf ace of the first circuit board and a side surface thereof connecting the upper and lower surfaces so as to embed therein the electronic component;
- a second circuit board that mounts the first circuit board on an upper surface thereof;
- a second mold member that covers the upper surface of the second circuit board so as to embed therein the first circuit board;
- and
- an underfill member supplied between the lower surf ace of the first circuit board and the upper surface of the second circuit board so as to cover a part of the side surf ace of the first circuit board that is exposed from the first mold member,
- wherein a lower area of the side surface of the first circuit board that is positioned on a side close to the lower surf ace is exposed so as not to be covered with the first mold member.
5 more elements
A method of manufacturing an electric circuit module, the method comprising:
- a first step of preparing a first circuit board having a plurality of terminal electrodes on a lower surface thereof and an electronic component on an upper surface of the first circuit board positioned on a side opposite to the lower surf ace and sticking the lower surf ace of the first circuit board to a support member;
- a second step of covering, with a space forming material, a side surf ace of the first circuit board that connects the upper and lower surfaces not entirely, but selectively at a lower area of the side surf ace positioned on a side close to the lower surface;
- a third step of forming a first mold member that covers the upper and side surfaces of the first circuit board so as to embed therein the electronic component;
- a fourth step of removing the support member and space forming material and cutting the first mold member for individualization;
- a fifth step of preparing a second circuit board and mounting the first circuit board on an upper surface of the second circuit board;
- a sixth step of filling an underfill material between the lower surf ace of the first circuit board and the upper surface of the second circuit board;
- and
- a seventh step of forming a second mold member that covers the upper surface of the second circuit board so as to embed therein the first circuit board.
5 more elements
Dependencies are inferred from the claim text.