H05K 2203/0178
Projectile
Official title: Projectile, e.g. for perforating substrate
H05K2203/0178 (Projectile) appears on 2 US grants and 5 published applications in this corpus.
Search patents in H05K- Granted patents
- 2
- Published applications
- 5
- Assignees
- 3
- Inventors
- 10
- Latest grant
- 12 May 2020
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2010 | 0 | 1 |
| 2011 | 0 | 1 |
| 2012 | 1 | 1 |
| 2013 | 0 | 1 |
| 2014 | 0 | 0 |
| 2015 | 0 | 0 |
| 2016 | 0 | 0 |
| 2017 | 0 | 0 |
| 2018 | 0 | 0 |
| 2019 | 0 | 0 |
| 2020 | 1 | 1 |
By publication year.
Recent patents
- Rotary connector and method for assembling same21 May 2020US 2020/0161819 A1Alps Alpine Co., Ltd.
- Printed Circuit Board and Method Of Manufacturing The Same6 Jun 2013US 2013/0139383 A1Samsung Electro-Mechanics Co., Ltd.
- Method and system for processing frozen adhesive particles6 Dec 2012US 2012/0304923 A1Nederlandse Organisatie voor toegepast-natuurwetenschappelijk onderzoek TNO
- Printed circuit board adn method of manufacturing the same3 Nov 2011US 2011/0266038 A1Samsung Electro-Mechanics Co., Ltd.
- Method and system for processing frozen adhesive particles29 Jul 2010US 2010/0189892 A1Nederlandse Organisatie voor toegepast-natuurwetenschappelijk onderzoek TNO
Most cited
By later US patents