H05K 2203/0195
Tool for a process not provided for in h05k3/00
Official title: Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
H05K2203/0195 (Tool for a process not provided for in h05k3/00) appears on 726 US grants and 543 published applications in this corpus.
Search patents in H05K- Granted patents
- 726
- Published applications
- 543
- Assignees
- 395
- Inventors
- 1,637
- Latest grant
- 11 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 2 | 0 |
| 1978 | 3 | 0 |
| 1979 | 2 | 0 |
| 1980 | 4 | 0 |
| 1981 | 1 | 0 |
| 1982 | 5 | 0 |
| 1983 | 4 | 0 |
| 1984 | 7 | 0 |
| 1985 | 4 | 0 |
| 1986 | 10 | 0 |
| 1987 | 10 | 0 |
| 1988 | 8 | 0 |
| 1989 | 15 | 0 |
| 1990 | 12 | 0 |
| 1991 | 18 | 0 |
| 1992 | 15 | 0 |
| 1993 | 16 | 0 |
| 1994 | 14 | 0 |
| 1995 | 15 | 0 |
| 1996 | 5 | 0 |
| 1997 | 15 | 0 |
| 1998 | 22 | 0 |
| 1999 | 21 | 0 |
| 2000 | 24 | 0 |
| 2001 | 26 | 25 |
| 2002 | 32 | 26 |
| 2003 | 31 | 24 |
| 2004 | 20 | 30 |
| 2005 | 20 | 35 |
| 2006 | 22 | 37 |
| 2007 | 19 | 27 |
| 2008 | 16 | 33 |
| 2009 | 19 | 28 |
| 2010 | 27 | 39 |
| 2011 | 19 | 19 |
| 2012 | 22 | 14 |
| 2013 | 13 | 10 |
| 2014 | 13 | 17 |
| 2015 | 15 | 20 |
| 2016 | 22 | 13 |
| 2017 | 14 | 14 |
| 2018 | 15 | 29 |
| 2019 | 18 | 16 |
| 2020 | 23 | 16 |
| 2021 | 19 | 23 |
| 2022 | 15 | 10 |
| 2023 | 11 | 7 |
| 2024 | 12 | 13 |
| 2025 | 4 | 8 |
| 2026 | 5 | 10 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Press-in machine for pressing components into a substrate, in particular into a printed circuit board or carrier plate, with substrate positioning11 Aug 2026US 12,707,617 B2ERSA GmbH
- Removable lid for flip chip-ball grid array (FC-BGA) packages7 Jul 2026US 12,677,380 B2Mellanox Technologies, Ltd.
- Package bottom side thermal solution with discrete hat-shaped copper spreader component16 Jun 2026US 12,660,077 B2Intel Corporation
- Electronic device and manufacturing method thereof31 Mar 2026US 12,593,399 B2Carux Technology Pte. Ltd.
- Method for creating interconnections between a substrate and electronic components3 Feb 2026US 12,543,270 B2
- Component covers inhibiting dynamic component warping during reflow10 Sep 2026US 2026/0271194 A1International Business Machines Corporation
- Method for manufacturing circuit board, apparatus for packaging circuit board, and electronic apparatus27 Aug 2026US 2026/0255497 A1Samsung Display Co., Ltd.
- Pressing apparatus, method of manufacturing display device, and electronic device4 Jun 2026US 2026/0156758 A1Samsung Display Co., Ltd.
- Feeding device for circuit board and electroplating equipment7 May 2026US 2026/0129769 A1Universal Circuit Board Equipment Co., Ltd.
- Pcb stencil printing with shrinkage compensation23 Apr 2026US 2026/0113851 A1International Business Machines Corporation
Most cited
By later US patents
- Component crimping apparatus control method, component crimping apparatus, and measuring tool472US 8,078,310 B2Panasonic Corporation · 2011
- Specialized tool adapted for a process for manufacture and interconnection between adjoining printed wiring boards178US 6,464,121 B2Xerox Corporation · 2002
- Method for attaching conductive balls to a substrate134US 5,284,287 AMotorola, Inc. · 1994
- Method of aligning and mounting solder balls to a substrate131US 5,118,027 AInternational Business Machines Corporation · 1992
- Solder ball interconnected assembly129US 5,591,941 AInternational Business Machines Corporation · 1997