H05K 2203/0191
Using tape or non-metallic foil in a process
Official title: Using tape or non-metallic foil in a process, e.g. during filling of a hole with conductive paste
H05K2203/0191 (Using tape or non-metallic foil in a process) appears on 418 US grants and 377 published applications in this corpus.
Search patents in H05K- Granted patents
- 418
- Published applications
- 377
- Assignees
- 227
- Inventors
- 941
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 3 | 0 |
| 1977 | 1 | 0 |
| 1978 | 0 | 0 |
| 1979 | 2 | 0 |
| 1980 | 2 | 0 |
| 1981 | 3 | 0 |
| 1982 | 0 | 0 |
| 1983 | 1 | 0 |
| 1984 | 4 | 0 |
| 1985 | 4 | 0 |
| 1986 | 5 | 0 |
| 1987 | 4 | 0 |
| 1988 | 5 | 0 |
| 1989 | 10 | 0 |
| 1990 | 7 | 0 |
| 1991 | 1 | 0 |
| 1992 | 0 | 0 |
| 1993 | 5 | 0 |
| 1994 | 3 | 0 |
| 1995 | 9 | 0 |
| 1996 | 9 | 0 |
| 1997 | 2 | 0 |
| 1998 | 12 | 0 |
| 1999 | 16 | 0 |
| 2000 | 18 | 0 |
| 2001 | 22 | 9 |
| 2002 | 12 | 20 |
| 2003 | 14 | 18 |
| 2004 | 23 | 25 |
| 2005 | 14 | 27 |
| 2006 | 11 | 20 |
| 2007 | 12 | 31 |
| 2008 | 16 | 32 |
| 2009 | 19 | 36 |
| 2010 | 16 | 19 |
| 2011 | 24 | 21 |
| 2012 | 14 | 9 |
| 2013 | 8 | 9 |
| 2014 | 7 | 9 |
| 2015 | 3 | 17 |
| 2016 | 7 | 14 |
| 2017 | 10 | 6 |
| 2018 | 8 | 5 |
| 2019 | 6 | 10 |
| 2020 | 10 | 9 |
| 2021 | 9 | 12 |
| 2022 | 10 | 7 |
| 2023 | 4 | 3 |
| 2024 | 4 | 5 |
| 2025 | 6 | 3 |
| 2026 | 3 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Tape processing method6 Oct 2026US 12,757,333 B2Chipbond Technology Corporation
- Bonding method and a bonding apparatus for implementing the bonding method16 Jun 2026US 12,654,974 B2
- Large area laser printing system and method17 Feb 2026US 12,552,179 B2Reophotonics, Ltd.
- Method for embedding a component in a printed circuit board16 Dec 2025US 12,501,551 B2AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Component mount board30 Sep 2025US 12,432,857 B2Mektec Corporation
- Tape and manufacturing method thereof5 Mar 2026US 2026/0068058 A1Chipbond Technology Corporation
- Method for manufacturing conductive via-containing substrate, conductive via-containing substrate, and metal paste25 Dec 2025US 2025/0387833 A1
- Method for Embedding a Component in a Printed Circuit Board10 Jul 2025US 2025/0227850 A1AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Printed circuit board12 Jun 2025US 2025/0194017 A1Samsung Electro-Mechanics Co., Ltd.
- Bonding method and a bonding apparatus for implementing the bonding method12 Dec 2024US 2024/0409354 A1All Ring Tech Co., Ltd.
Most cited
By later US patents
- Method for making printed circuit boards with selectivity filled plated through holes200US 5,487,218 AInternational Business Machines Corporation · 1996
- Porous substrate and conductive ink filled vias for printed circuits181US 5,346,750 AMatsushita Electric Industrial Co., Ltd. · 1994
- Manufacturing circuit board assemblies having filled vias171US 5,822,856 AInternational Business Machines Corporation · 1998
- Connecting member of a circuit substrate and method of manufacturing multilayer circuit substrates by using the same153US 5,484,647 AMatsushita Electric Industrial Co., Ltd. · 1996
- Printed circuit board through hole technique143US 4,964,948 AProtoCAD, Inc. · 1990