Printed circuit board

A printed circuit board comprising:

• an integrated passive device (IPD) including a body, a plurality of copper pads disposed on the body to be spaced apart from each other, and a polyimide film having at least a portion disposed between two adjacent metal pads, among the plurality of copper pads, on the body, the polyimide film covering at least a portion of an upper surface and at least a portion of a side surface of one of the plurality of copper pads;
• and
• an Ajinomoto build-up film (ABF) covering at least another portion of the upper surface of the one of the plurality of copper pads and at least a portion of the polyimide film,
• wherein at least another portion of the upper surface of the one of the plurality of copper pads, covered by the ABF, has a surface roughness greater than that of at least a portion of a lower surface of the one of the plurality of metal pads in contact with the body.

A printed circuit board comprising:

• an electronic component including a body, a metal pad disposed on the body, and a passivation layer covering a portion of the metal pad;
• an insulating layer covering at least a portion of the electronic component;
• a wiring layer disposed on the insulating layer;
• and
• a connection via disposed in the insulating layer to connect the wiring layer and the metal pad to each other,
• wherein the passivation layer has an opening exposing a portion of an upper surface of the metal pad,
• the portion of the upper surface of the metal pad, exposed by the passivation layer and being in contact with the insulating layer and the connection via, has a surface roughness greater than that of a portion of a lower surface of the metal pad in contact with the body.