Bonding method and a bonding apparatus for implementing the bonding method

A bonding method for using a bonding apparatus including a bonding module, comprising:

• transporting and reeling a carrier tape packaged with an adhering component on a pressing assembly of a first pressing mechanism of the bonding module, and bending the carrier tape through a bending member of the pressing assembly to be divided into an input section and an output section by the bending member;
• driving a roller of the pressing assembly to indirectly press and abut a front end of the adhering component through the carrier tape to bring the adhering component into contact with a bonding start point of a bonding area of a base component;
• rolling the roller over the carrier tape to attach the adhering component to the bonding area of the base component from the bonding start point to a bonding finish point of the bonding area;
• and
• during the step of rolling of the roller, moving the bending member together with the roller to bring the bending member to indirectly scrape the adhering component from the carrier tape through the carrier tape.