H05K 2203/0169
Using a temporary frame during processing
H05K2203/0169 (Using a temporary frame during processing) appears on 105 US grants and 131 published applications in this corpus.
Search patents in H05K- Granted patents
- 105
- Published applications
- 131
- Assignees
- 87
- Inventors
- 263
- Latest grant
- 1 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 1 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 2 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 1 |
| 2003 | 2 | 5 |
| 2004 | 3 | 2 |
| 2005 | 1 | 4 |
| 2006 | 1 | 3 |
| 2007 | 4 | 6 |
| 2008 | 5 | 12 |
| 2009 | 4 | 10 |
| 2010 | 4 | 10 |
| 2011 | 6 | 11 |
| 2012 | 6 | 9 |
| 2013 | 13 | 4 |
| 2014 | 5 | 10 |
| 2015 | 7 | 11 |
| 2016 | 11 | 3 |
| 2017 | 3 | 3 |
| 2018 | 5 | 3 |
| 2019 | 2 | 6 |
| 2020 | 3 | 2 |
| 2021 | 4 | 7 |
| 2022 | 3 | 4 |
| 2023 | 3 | 1 |
| 2024 | 5 | 3 |
| 2025 | 0 | 0 |
| 2026 | 1 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
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- Screen loading system10 Dec 2024US 12,162,264 B2Asmpt Smt Singapore Pte. Ltd.
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- Apparatus for manufacturing printed circuit boards16 Apr 2024US 11,963,306 B2Gebr. Schmid GmbH & Co.
- Apparatus for manufacturing printed circuit boards27 Feb 2024US 11,917,767 B2Gebr. Schmid GmbH & Co.
- Electrically connecting a flexible circuit to a support structure27 Aug 2026US 2026/0255501 A1Teradyne, Inc.
- Assembly sheet and method for producing assembly sheet27 Jun 2024US 2024/0215155 A1Nitto Denko Corporation
- Method for manufacturing printed circuit boards9 May 2024US 2024/0155773 A1Gebr. Schmid GmbH & Co.
- Assembly sheet28 Mar 2024US 2024/0107679 A1Nitto Denko Corporation
- Printed circuit board stack structure and manufacturing method thereof27 Jul 2023US 2023/0240014 A1Unimicron Technology Corp.
Most cited
By later US patents
- Substrate for a flexible microelectronic assembly and a method of fabricating thereof47US 7,659,617 B2Tessera, Inc. · 2010
- Method of manufacturing multilayer electronic component30US 5,412,865 AMurata Manufacturing Co., Ltd. · 1995
- Maintainable substrate carrier for electroplating27US 8,221,601 B2SunPower Corporation · 2012
- Forming multilayer ceramic substrates from large area green sheets22US 4,539,058 AInternational Business Machines Corporation · 1985
- Methods for connecting a wire to a feedthrough pin and apparatus including a wire connected to a feedthrough pin by the method14US 10,064,288 B2Advanced Bionics AG · 2018