Electronic component and method for manufacturing electronic component

A method for manufacturing an electric component including a printed circuit board with each of a pair of surfaces serving as a component mounting surface, the method for manufacturing the electric component comprising:

• a first step of supplying a resin material having flowability to a first predetermined region of one of the component mounting surfaces, and curing the resin material to coat the first predetermined region and electronic components in the first predetermined region with resin;
• and
• a second step of supplying the resin material having flowability to a second predetermined region of an other one of the component mounting surfaces, and curing the resin material to coat the second predetermined region and electronic components in the second predetermined region with resin,
• the first and second steps being sequentially performed,
• in each of the first and second steps, the resin material being supplied so that a predetermined one of the electronic components in each of the first and second predetermined regions is not covered with resin at a portion above a predetermined height from the component mounting surface,
• the printed circuit board having an open hole, and
• the printed circuit board being provided with a plug to stop the resin material from flowing into the open hole.