Apparatus for manufacturing printed circuit boards
AssigneeGebr. Schmid GmbH & Co.
InventorChristian Schmid
Life of this patent
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AssigneeGebr. Schmid GmbH & Co.
InventorChristian Schmid
Estimating the term…
A method of manufacturing printed circuit boards includes some or all of: chemically or electrically applying metallic layers to a substrate; incorporating bores into the substrate; through-contacting the bores incorporated into the substrate; applying a layer from a photoresist to an electrically conducting layer in a masking step; exposing the photoresist while using an exposure mask in an exposing step; removing exposed or unexposed regions of the layer from the photoresist while in regions laying bare the electrically conducting layer in a developing step; removing the laid-bare regions of the electrically conducting layer in an etching step; cleaning the substrate in a rinsing step; and drying the substrate, wherein the substrate for carrying out the developing step and/or the etching step is set in rotation and a developer solution and/or an etching liquid is applied to the rotating substrate by at least one nozzle.
A device for manufacturing printed circuit boards, the circuit boards each comprising:
Dependencies are inferred from the claim text.