Forming multilayer ceramic substrates from large area green sheets

A method of forming a multilayer ceramic substrate comprising the steps of:

• fabricating an array of layer sites on a large area ceramic green sheet, each layer site comprising a plurality of conductive vias interconnected with a surface conductive pattern, the area of said ceramic green sheet being sufficiently large to preclude alignment of corresponding vias on superimposed large area ceramic green sheets;
• aligning a reference mark on one of said layer sites with respect to a die cavity by determining the dimensional offset of said reference mark from its nominal position and indexing said layer site with respect to said die cavity with said dimensional offset being applied such that said reference mark lies a predetermined distance from the edge of said die cavity;
• punching the aligned individual layer site into said die cavity;
• repeating said aligning and punching steps to stack a plurality of aligned and punched layer sites;
• and
• laminating the stacked plurality of aligned and punched layer sites to form a multilayer ceramic substrate;
• whereby the vias in the stacked layer sites are aligned notwithstanding the dimensional distortion of layer sites with respect to one another on said large area ceramic green sheet.