Method of manufacturing multilayer electronic component

A method of manufacturing a layered product having a plurality of sheets for use in a multilayer electronic component, said method comprising the steps of:

• preparing a mother sheet for providing a plurality of sheets of a layered product, said mother sheet being supported on a base;
• preparing a frame for receiving each of said plurality of sheets so as to align and stack said sheets, said frame defining an inner stacking area having dimensions sized for positioning said sheets therein and an upper rim surface of said frame surrounding said stacking area, a stacking table forming a bottom of said stacking area so as to define a depth of said stacking area, means for adjusting the depth of said stacking area so as to bring a sheet previously stacked therein to a level at least as high as said upper rim surface of said frame;
• moving said mother sheet supported on said base to said frame;
• cutting said mother sheet in dimensions corresponding to said inner dimensions of said frame to obtain respective ones of said plurality of sheets from said mother sheet;
• successively stacking each sheet of said plurality of sheets at said stacking area of said frame by transferring each sheet from said base, each sheet being transferred to said frame so as to contact said sheet previously stacked therein at substantially a level at least as high as said upper rim surface of said frame whereby substantially no air remains between said sheet being transferred and said previously stacked sheet when stacked;
• pressurizing said stacked sheets in said frame;
• preparing a patterned conductor film, said patterned conductor film being supported on a second base;
• and
• transferring said conductor film onto said stacked sheets to form a layered product.