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US 2024/0215155 A1Published application
Assembly sheet and method for producing assembly sheet
AssigneeNitto Denko Corporation
InventorMakoto TSUNEKAWA
Life of this patent
Estimating the term…
Abstract
An assembly sheet includes a wiring circuit board, a frame, and a reinforcement portion. The wiring circuit board has a support layer, a base insulating layer, and a conductive pattern. The frame supports the wiring circuit board. The reinforcement portion is disposed on the frame and reinforces the frame. The reinforcement portion has a first layer made of a metal and a second layer made of a metal.
Claims10
An assembly sheet comprising:
- a wiring circuit board having a support layer, an insulating layer disposed on one surface of the support layer in a thickness direction, and a conductive pattern disposed on one surface of the insulating layer in the thickness direction;
- a frame supporting the wiring circuit board;
- and
- a reinforcement portion disposed on the frame in the thickness direction and reinforcing the frame, wherein
- the reinforcement portion has a first layer made of a metal, and
- a second layer disposed on the first layer in the thickness direction and made of a metal.
3 more elements
Dependencies are inferred from the claim text.