Maintainable substrate carrier for electroplating

A method of electroplating substrates, the method comprising:

• clipping the substrates to a substrate carrier, the substrate carrier comprising a non-conductive carrier body on which the substrates are placed, conductive lines embedded within the carrier body, conductive clip attachment parts attached in a permanent manner to the conductive lines, and contact clips attached in a removable manner to the clip attachment parts;
• mounting the substrate carrier onto a mechanical arm;
• applying a voltage to the substrates via the contact clips;
• and
• dipping the substrate carrier with the substrates clipped thereon into an electroplating bath;
• and
• unclipping the substrates from the substrate carrier when the electroplating is complete.