H05K 2203/0165
Holder for holding a printed circuit board [pcb] during processing
Official title: Holder for holding a Printed Circuit Board [PCB] during processing, e.g. during screen printing
H05K2203/0165 (Holder for holding a printed circuit board [pcb] during processing) appears on 228 US grants and 225 published applications in this corpus.
Search patents in H05K- Granted patents
- 228
- Published applications
- 225
- Assignees
- 179
- Inventors
- 618
- Latest grant
- 1 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1980 | 1 | 0 |
| 1981 | 0 | 0 |
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 4 | 0 |
| 1988 | 0 | 0 |
| 1989 | 3 | 0 |
| 1990 | 1 | 0 |
| 1991 | 3 | 0 |
| 1992 | 4 | 0 |
| 1993 | 4 | 0 |
| 1994 | 5 | 0 |
| 1995 | 3 | 0 |
| 1996 | 3 | 0 |
| 1997 | 0 | 0 |
| 1998 | 7 | 0 |
| 1999 | 4 | 0 |
| 2000 | 8 | 0 |
| 2001 | 6 | 4 |
| 2002 | 6 | 9 |
| 2003 | 8 | 7 |
| 2004 | 5 | 8 |
| 2005 | 6 | 13 |
| 2006 | 10 | 14 |
| 2007 | 7 | 4 |
| 2008 | 5 | 17 |
| 2009 | 6 | 14 |
| 2010 | 7 | 6 |
| 2011 | 10 | 9 |
| 2012 | 5 | 8 |
| 2013 | 5 | 4 |
| 2014 | 4 | 6 |
| 2015 | 4 | 9 |
| 2016 | 12 | 5 |
| 2017 | 5 | 15 |
| 2018 | 6 | 10 |
| 2019 | 11 | 9 |
| 2020 | 11 | 11 |
| 2021 | 7 | 8 |
| 2022 | 5 | 7 |
| 2023 | 7 | 6 |
| 2024 | 6 | 9 |
| 2025 | 4 | 5 |
| 2026 | 7 | 8 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Method for manufacturing printed circuit boards1 Sep 2026US 12,727,090 B2Gebr. Schmid GmbH & Co.
- Method for manufacturing a multilayer circuit board14 Jul 2026US 12,684,698 B2Avary Holding (Shenzhen) Co., Limited.
- Method of manufacturing semiconductor device and jig set16 Jun 2026US 12,654,263 B2Fuji Electric Co., Ltd.
- Base board floating arm16 Jun 2026US 12,660,092 B2Sheng Chuan Technology Co., Ltd.
- Method for manufacturing a multilayer circuit board26 May 2026US 12,641,732 B2Avary Holding (Shenzhen) Co., Limited.
- Circuit board processing equipment8 Oct 2026US 2026/0313808 A1Wistron Corporation
- Semiconductor package warpage and alignment management17 Sep 2026US 2026/0282241 A1Arm Limited
- Straddle-mount connector rework27 Aug 2026US 2026/0255496 A1International Business Machines Corporation
- Multilayer circuit board with embedded module30 Jul 2026US 2026/0223296 A1Avary Holding (Shenzhen) Co., Limited.
- Flipping device and electroplating production line7 May 2026US 2026/0129768 A1Universal Circuit Board Equipment Co., Ltd.
Most cited
By later US patents
- Laser beam scanning method for forming via holes in polymer materials168US 4,894,115 AGeneral Electric Company · 1990
- High speed, high accuracy multi-stage tool positioning system143US 5,751,585 AElectro Scientific Industries, Inc. · 1998
- Method for attaching a flip chip on flexible circuit carrier using chip with metallic cap on solder124US 5,729,896 AInternational Business Machines Corporation · 1998
- Method and apparatus for mounting a flexible film semiconductor chip carrier on a circuitized substrate122US 5,159,535 AInternational Business Machines Corporation · 1992
- Blind via laser drilling system115US 6,211,485 B12001