Method of manufacturing semiconductor device and jig set

A method of manufacturing a semiconductor device, comprising:

• preparing an insulated circuit board having a first surface and a second surface opposite to each other, and a cooling unit including a cooling surface;
• preparing a jig set including
• a positioning jig having an opening that corresponds to a size of the insulated circuit board in a plan view of the semiconductor device, to thereby define a fixing area for housing the insulated circuit board therein, and
• a height control jig including a control part shaped to be fitted into the fixing area of the positioning jig, the control part having, at a lower end thereof, a pressing surface;
• housing the entire insulated circuit board in the fixing area of the positioning jig, setting a bonding member on the first surface of the insulated circuit board, and disposing the positioning jig on the cooling surface of the cooling unit;
• and
• pressing the height control jig to thereby press the second surface of the insulated circuit board housed in the fixing area toward the cooling surface, while pressing the positioning jig onto the cooling surface by applying a positioning weight onto the positioning jig.