H05K 2203/0152
Temporary metallic carrier
Official title: Temporary metallic carrier, e.g. for transferring material
H05K2203/0152 (Temporary metallic carrier) appears on 376 US grants and 329 published applications in this corpus.
Search patents in H05K- Granted patents
- 376
- Published applications
- 329
- Assignees
- 206
- Inventors
- 871
- Latest grant
- 9 Jun 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 5 | 0 |
| 1977 | 2 | 0 |
| 1978 | 2 | 0 |
| 1979 | 2 | 0 |
| 1980 | 1 | 0 |
| 1981 | 2 | 0 |
| 1982 | 4 | 0 |
| 1983 | 7 | 0 |
| 1984 | 4 | 0 |
| 1985 | 3 | 0 |
| 1986 | 5 | 0 |
| 1987 | 5 | 0 |
| 1988 | 5 | 0 |
| 1989 | 7 | 0 |
| 1990 | 3 | 0 |
| 1991 | 7 | 0 |
| 1992 | 8 | 0 |
| 1993 | 6 | 0 |
| 1994 | 8 | 0 |
| 1995 | 5 | 0 |
| 1996 | 5 | 0 |
| 1997 | 7 | 0 |
| 1998 | 6 | 0 |
| 1999 | 7 | 0 |
| 2000 | 6 | 0 |
| 2001 | 16 | 4 |
| 2002 | 8 | 18 |
| 2003 | 12 | 9 |
| 2004 | 12 | 12 |
| 2005 | 5 | 12 |
| 2006 | 6 | 16 |
| 2007 | 7 | 19 |
| 2008 | 6 | 20 |
| 2009 | 9 | 27 |
| 2010 | 16 | 23 |
| 2011 | 12 | 15 |
| 2012 | 20 | 13 |
| 2013 | 13 | 8 |
| 2014 | 11 | 17 |
| 2015 | 13 | 20 |
| 2016 | 12 | 13 |
| 2017 | 14 | 11 |
| 2018 | 9 | 15 |
| 2019 | 10 | 7 |
| 2020 | 10 | 11 |
| 2021 | 7 | 7 |
| 2022 | 7 | 6 |
| 2023 | 3 | 9 |
| 2024 | 6 | 7 |
| 2025 | 8 | 5 |
| 2026 | 2 | 5 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Transparent circuit board9 Jun 2026US 12,652,761 B2Avary Holding (Shenzhen) Co., Limited.
- Method of using an organizer for manufacture of electronic device with cabled interconnects6 Jan 2026US 12,519,277 B2Amphenol Corporation
- Semi-additive process for catalytic printed circuit boards30 Dec 2025US 12,513,827 B2Catlam, LLC
- Device including semiconductor chips and method for producing such device30 Sep 2025US 12,431,450 B2Infineon Technologies AG
- Patterned conductive article15 Jul 2025US 12,363,825 B23M Innovative Properties Company
- Printed circuit board and manufacturing method thereof27 Aug 2026US 2026/0255479 A1Samsung Electro-Mechanics Co., Ltd.
- Semi-Additive Process for Printed Circuit Boards11 Jun 2026US 2026/0164566 A1Catlam, LLC
- Circuit19 Mar 2026US 2026/0082486 A1Chibitronics Inc.
- Ultra-thin copper foil with carrier foil and method for manufacturing embedded substrate by using same29 Jan 2026US 2026/0032815 A1Lotte Energy Materials Corporation
- Circuit board manufacturing method15 Jan 2026US 2026/0020148 A1Mitsui Mining & Smelting Co., Ltd.
Most cited
By later US patents
- Method for manufacturing a stretchable electronic device167US 8,207,473 B2Imec · 2012
- Method for manufacturing polyimide multilayer wiring substrate161US 5,322,593 ANEC Corporation · 1994
- Flip chip type semiconductor device and method for manufacturing the same132US 6,406,942 B2NEC Corporation · 2002
- Process for thin film interconnect112US 5,231,751 AInternational Business Machines Corporation · 1993
- Methods of fixturing flexible circuit substrates and a processing carrier, processing a flexible circuit and processing a flexible circuit substrate relative to a processing carrier108US 5,972,152 AMicron Communications, Inc. · 1999