Methods of fixturing flexible circuit substrates and a processing carrier, processing a flexible circuit and processing a flexible circuit substrate relative to a processing carrier

A method of processing a flexible circuit, comprising:

• providing a processing carrier having a support surface;
• providing a flexible circuit substrate having a first surface and a second surface;
• providing a unitary adhesive film comprising plural adhesive films and the unitary adhesive film having a first adherent surface and a second adherent surface;
• adhering the first adherent surface of the unitary adhesive film with the support surface of the processing carrier;
• adhering the second adherent surface of the unitary adhesive film with the first surface of the flexible circuit substrate;
• and
• processing the second surface of the flexible circuit substrate with the first adherent surface of the unitary adhesive film being adhered to the support surface of the processing carrier and the second adherent surface thereof being adhered to the first surface of the flexible circuit substrate.

A method of processing a flexible circuit substrate relative to a processing carrier, comprising:

• providing a unitary adhesive film comprising plural adhesive films and the unitary adhesive film having a first adherent surface and a second adherent surface;
• adhering the processing carrier and the first adherent surface of the unitary adhesive film;
• adhering the flexible circuit substrate and the second adherent surface of the unitary adhesive film;
• and
• after the adherings, separating the flexible circuit substrate and the second adherent surface of the unitary adhesive film with the first adherent surface and the processing carrier remaining adhered.

A method of fixturing a flexible circuit substrate and a processing carrier, comprising:

• providing a flexible circuit substrate having a first surface;
• providing a processing carrier having a support surface;
• applying a first adhesion force using a first adhesive film against the support surface of the processing carrier;
• and
• applying a second adhesion force using a second adhesive film against substantially the total surface area of the first surface of the flexible circuit substrate.

A method of fixturing a flexible circuit substrate and a processing carrier, comprising:

• providing a flexible circuit substrate having a first surface;
• providing a processing carrier having a support surface;
• and
• attaching substantially the total surface area of the first surface of the flexible circuit substrate and the support surface of the processing carrier using plural adhesive films intermediate the first surface of the flexible circuit substrate and the support surface of the processing carrier.

A method of fixturing a flexible circuit substrate and a processing carrier, comprising:

• providing a flexible circuit substrate having a first surface and a unitary adhesive film comprising plural adhesive films attached thereto;
• providing a processing carrier having a support surface;
• and
• attaching the unitary adhesive film and the support surface of the processing carrier.

A method of processing a flexible circuit, comprising:

• providing a processing carrier having a support surface;
• providing a flexible circuit substrate having a first surface and a second surface;
• fixturing the first surface of the flexible circuit substrate to the support surface of the processing carrier;
• and
• covering the second surface of the flexible circuit substrate with an encapsulating material.

A method of fixturing a flexible circuit substrate and a processing carrier, comprising:

• providing a first film having a first adherent surface;
• providing a second film having a second adherent surface;
• joining the first and second films to form a unitary adhesive film having the first adherent surface and the second adherent surface on opposing outer sides thereof;
• providing a flexible circuit substrate;
• providing a processing carrier;
• and
• attaching the flexible circuit substrate and the processing carrier together with the adhesive film therebetween.