Device including semiconductor chips and method for producing such device
AssigneeInfineon Technologies AG
InventorsPetteri Palm, Thorsten Scharf
Life of this patent
Estimating the term…
Abstract
A device includes a first semiconductor chip including a first face, wherein a first contact pad is arranged over the first face. The device further includes a second semiconductor chip including a first face, wherein a first contact pad is arranged over the first face, wherein the first semiconductor chip and the second semiconductor chip are arranged such that the first face of the first semiconductor chip faces in a first direction and the first face of the second semiconductor chip faces in a second direction opposite to the first direction. The first semiconductor chip is located laterally outside of an outline of the second semiconductor chip.
Claims20
A device comprising:
- a top side;
- a bottom side opposite the top side;
- an insulation layer disposed between the top side and the bottom side;
- and
- at least a first semiconductor chip and an other semiconductor chip, wherein:
- the first semiconductor chip includes a first face facing the top side and an opposing second face facing the bottom side, and includes at least a first contact pad arranged over the first face of the first semiconductor chip;
- and
- the other semiconductor chip includes a first face facing the bottom side and an opposing second face facing the top side, and includes at least a first contact pad arranged over the first face of the other semiconductor chip;
- wherein the first semiconductor chip and the other semiconductor chip are each disposed sans carrier within the insulation layer, wherein the second face of the first semiconductor chip and the first face of the other semiconductor chip are each spaced within the insulation layer from the bottom side of the device, and wherein the first face of the first semiconductor chip is at least at a same height above the bottom side of the device as a height of the first face of the other semiconductor chip above the bottom side of the device.
A device comprising:
- a top side;
- a bottom side opposite the top side;
- an insolation layer disposed between the top side and the bottom side;
- and
- at least a first semiconductor chip and an other semiconductor chip, wherein:
- the first semiconductor chip includes a first face facing the top side and an opposing second face facing the bottom side, and includes at least a first contact pad arranged over the first face of the first semiconductor chip;
- and
- the other semiconductor chip includes a first face facing the bottom side and an opposing second face facing the top side, and includes at least a first contact pad arranged over the first face of the other semiconductor chip;
- wherein the first semiconductor chip and the other semiconductor chip are each disposed sans carrier within the insulation layer, wherein the second face of the first semiconductor chip and the first face of the other semiconductor are each spaced within the insulation layer from the bottom side of the device, wherein the first face of the first semiconductor chip and the first face of the other semiconductor chip are at a same height between the bottom side and top side of the device, and in a direction extending between the bottom side and top side the other semiconductor chip has a thickness different than a thickness of the first semiconductor chip.
Dependencies are inferred from the claim text.