H05K 2203/0156
Temporary polymeric carrier or foil
Official title: Temporary polymeric carrier or foil, e.g. for processing or transferring
H05K2203/0156 (Temporary polymeric carrier or foil) appears on 372 US grants and 374 published applications in this corpus.
Search patents in H05K- Granted patents
- 372
- Published applications
- 374
- Assignees
- 244
- Inventors
- 1,002
- Latest grant
- 14 Apr 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 3 | 0 |
| 1977 | 2 | 0 |
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 1 | 0 |
| 1982 | 2 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 2 | 0 |
| 1986 | 5 | 0 |
| 1987 | 5 | 0 |
| 1988 | 2 | 0 |
| 1989 | 8 | 0 |
| 1990 | 9 | 0 |
| 1991 | 8 | 0 |
| 1992 | 3 | 0 |
| 1993 | 3 | 0 |
| 1994 | 8 | 0 |
| 1995 | 1 | 0 |
| 1996 | 4 | 0 |
| 1997 | 5 | 0 |
| 1998 | 14 | 0 |
| 1999 | 13 | 0 |
| 2000 | 8 | 0 |
| 2001 | 14 | 7 |
| 2002 | 8 | 20 |
| 2003 | 8 | 13 |
| 2004 | 19 | 25 |
| 2005 | 12 | 13 |
| 2006 | 10 | 22 |
| 2007 | 8 | 22 |
| 2008 | 10 | 12 |
| 2009 | 10 | 32 |
| 2010 | 13 | 15 |
| 2011 | 8 | 15 |
| 2012 | 18 | 13 |
| 2013 | 8 | 8 |
| 2014 | 5 | 6 |
| 2015 | 7 | 13 |
| 2016 | 4 | 12 |
| 2017 | 3 | 11 |
| 2018 | 7 | 16 |
| 2019 | 9 | 12 |
| 2020 | 11 | 18 |
| 2021 | 21 | 24 |
| 2022 | 17 | 13 |
| 2023 | 6 | 11 |
| 2024 | 16 | 10 |
| 2025 | 8 | 7 |
| 2026 | 4 | 4 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Temporary carrier plate and manufacturing method thereof, and manufacturing method for packaging substrate14 Apr 2026US 12,604,414 B2Nantong Access Semiconductor Co., Ltd.
- Method for forming flipped-conductor-patch24 Mar 2026US 12,588,145 B2Microchip Technology Caldicot Limited
- Fabricating functional circuits on 3D freeform surfaces via intense pulsed light-induced zinc mass transfer17 Feb 2026US 12,557,223 B2The Penn State Research Foundation
- Method of using an organizer for manufacture of electronic device with cabled interconnects6 Jan 2026US 12,519,277 B2Amphenol Corporation
- Systems for printing viscous materials using laser assisted deposition23 Sep 2025US 12,420,479 B2Reophotonics, Ltd.
- Circuit board manufacturing device and circuit board manufacturing method30 Jul 2026US 2026/0223294 A1NHK Spring Co., Ltd.
- Temporary carrier plate and manufacturing method thereof, and manufacturing method for packaging substrate23 Jul 2026US 2026/0214810 A1Nantong Access Semiconductor Co., Ltd.
- Circuit board, method for manufacturing circuit board, and electronic device25 Jun 2026US 2026/0182474 A1Fict Limited
- Circuit board manufacturing method15 Jan 2026US 2026/0020148 A1Mitsui Mining & Smelting Co., Ltd.
- Transfer laminate and manufacturing method therefor27 Nov 2025US 2025/0365870 A1DIC Corporation
Most cited
By later US patents
- Injection molded printed circuits132US 5,220,488 AUFE Incorporated · 1993
- Electrically and thermally conductive adhesive transfer tape128US 4,606,962 AMinnesota Mining and Manufacturing Company · 1986
- Flexible film semiconductor chip carrier93US 4,681,654 AInternational Business Machines Corporation · 1987
- Area bonding conductive adhesive preforms89US 5,667,884 A1997
- Process for preparing printed circuits82US 4,722,765 APreh Elektrofeinmechanische Werke Jakob Preh Nachf. GmbH & Co. · 1988