H05K 2201/09563
Metal filled via
H05K2201/09563 (Metal filled via) appears on 1,004 US grants and 1,103 published applications in this corpus.
Search patents in H05K- Granted patents
- 1,004
- Published applications
- 1,103
- Assignees
- 336
- Inventors
- 2,067
- Latest grant
- 15 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 1 | 0 |
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 1 | 0 |
| 1981 | 5 | 0 |
| 1982 | 0 | 0 |
| 1983 | 2 | 0 |
| 1984 | 0 | 0 |
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 4 | 0 |
| 1988 | 4 | 0 |
| 1989 | 6 | 0 |
| 1990 | 10 | 0 |
| 1991 | 12 | 0 |
| 1992 | 13 | 0 |
| 1993 | 13 | 0 |
| 1994 | 16 | 0 |
| 1995 | 15 | 0 |
| 1996 | 14 | 0 |
| 1997 | 18 | 0 |
| 1998 | 15 | 0 |
| 1999 | 20 | 0 |
| 2000 | 18 | 0 |
| 2001 | 17 | 19 |
| 2002 | 25 | 23 |
| 2003 | 24 | 23 |
| 2004 | 28 | 26 |
| 2005 | 19 | 41 |
| 2006 | 23 | 52 |
| 2007 | 15 | 48 |
| 2008 | 24 | 71 |
| 2009 | 26 | 82 |
| 2010 | 43 | 49 |
| 2011 | 56 | 45 |
| 2012 | 52 | 48 |
| 2013 | 50 | 35 |
| 2014 | 35 | 38 |
| 2015 | 33 | 38 |
| 2016 | 27 | 46 |
| 2017 | 33 | 26 |
| 2018 | 33 | 28 |
| 2019 | 42 | 32 |
| 2020 | 23 | 47 |
| 2021 | 36 | 34 |
| 2022 | 27 | 53 |
| 2023 | 26 | 43 |
| 2024 | 35 | 63 |
| 2025 | 42 | 42 |
| 2026 | 20 | 51 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Embedded inductor structure and manufacturing method thereof15 Sep 2026US 12,739,976 B2Unimicron Technology Corp.
- Method of producing printed circuit boards and printed circuit boards produced in accordance with the method8 Sep 2026US 12,733,108 B2Gebr. Schmid GmbH & Co.
- Electrical interconnect structure with circuit bearing dielectric layers and resultant dielectric spacing control and circuit pitch reduction8 Sep 2026US 12,733,109 B2
- Haptic apparatus for stimulating users' skin1 Sep 2026US 12,721,997 B2City University of Hong Kong
- Ceramic-based circuit board assemblies formed using metal nanoparticles18 Aug 2026US 12,713,527 B2Kuprion Inc.
- Component Carrier With Electronic Component and Thick Thermally Conductive Layers on Both Sides1 Oct 2026US 2026/0304632 A1AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Semiconductor substrate including first and second conductive posts and a plurality of first and second circuit layer pads10 Sep 2026US 2026/0271754 A1Advanced Semiconductor Engineering, Inc.
- Device including board member and manufacturing methods27 Aug 2026US 2026/0255481 A1
- Printed circuit board27 Aug 2026US 2026/0255485 A1Samsung Electro-Mechanics Co., Ltd.
- Component Carrier and Method of Manufacturing the Same13 Aug 2026US 2026/0239535 A1AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
Most cited
By later US patents
- Method and apparatus for 3D interconnect542US 8,076,237 B2ASM America, Inc. · 2011
- Electroless CU deposition on a barrier layer by CU contact displacement for ULSI applications448US 5,891,513 ACornell Research Foundation, Inc. · 1999
- Integrated structures and fabrication methods thereof implementing a cell phone or other electronic system387US 7,619,901 B2EPIC Technologies, Inc. · 2009
- High-density, multi-level interconnects, flex circuits, and tape for tab285US 5,106,461 AMassachusetts Institute of Technology · 1992
- Interconnection method and structure for organic circuit boards248US 5,435,057 AInternational Business Machines Corporation · 1995