Printed circuit board
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsHo In Jun, Jung Eun Lee, Jin Hwan Kim
Life of this patent
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Abstract
A printed circuit board includes a plurality of insulating layers, a dielectric via disposed in at least one of the plurality of insulating layers, a first electrode layer and a second electrode layer disposed to oppose each other with the dielectric via interposed therebetween, a first through-via passing through at least one of the plurality of insulating layers, the first through-via connected to the first electrode layer, and a second through-via passing through at least one of the plurality of insulating layers, the second through-via connected to the second electrode layer.
Claims16
A printed circuit board comprising:
- a plurality of insulating layers;
- a dielectric via disposed in at least one of the plurality of insulating layers;
- a first electrode layer and a second electrode layer disposed to oppose each other with the dielectric via interposed therebetween;
- a first through-via passing through at least one of the plurality of insulating layers, the first through-via connected to the first electrode layer;
- and a second through-via passing through at least one of the plurality of insulating layers, the second through-via connected to the second electrode layer.
A printed circuit board comprising:
- a plurality of insulating layers having a dielectric via;
- a first electrode layer and a second electrode layer disposed to oppose each other with the dielectric via interposed therebetween;
- a first via layer passing through at least a portion of one of the plurality of insulating layers, the first via layer connected to the first electrode layer;
- and a second via layer passing through at least a portion of one of the plurality of insulating layers, the second via layer connected to the second electrode layer.
Dependencies are inferred from the claim text.