H01J 37/32724
Temperature
Official title: {Temperature}
H01J37/32724 (Temperature) appears on 1,282 US grants and 2,076 published applications in this corpus.
Search patents in H01J- Granted patents
- 1,282
- Published applications
- 2,076
- Assignees
- 271
- Inventors
- 3,341
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 1 | 0 |
| 1990 | 1 | 0 |
| 1991 | 1 | 0 |
| 1992 | 0 | 0 |
| 1993 | 1 | 0 |
| 1994 | 0 | 0 |
| 1995 | 4 | 0 |
| 1996 | 2 | 0 |
| 1997 | 2 | 0 |
| 1998 | 3 | 0 |
| 1999 | 2 | 0 |
| 2000 | 2 | 0 |
| 2001 | 1 | 0 |
| 2002 | 4 | 6 |
| 2003 | 3 | 3 |
| 2004 | 2 | 13 |
| 2005 | 2 | 8 |
| 2006 | 6 | 14 |
| 2007 | 3 | 21 |
| 2008 | 6 | 19 |
| 2009 | 3 | 19 |
| 2010 | 6 | 20 |
| 2011 | 15 | 14 |
| 2012 | 22 | 35 |
| 2013 | 21 | 36 |
| 2014 | 30 | 45 |
| 2015 | 29 | 78 |
| 2016 | 30 | 74 |
| 2017 | 39 | 102 |
| 2018 | 56 | 116 |
| 2019 | 88 | 163 |
| 2020 | 109 | 183 |
| 2021 | 103 | 161 |
| 2022 | 114 | 223 |
| 2023 | 142 | 205 |
| 2024 | 147 | 188 |
| 2025 | 168 | 191 |
| 2026 | 112 | 139 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Shutter disc for a semiconductor processing tool6 Oct 2026US 12,753,488 B2Taiwan Semiconductor Manufacturing Company.Ltd
- External cooling assembly for substrate support6 Oct 2026US 12,755,943 B2APPLIED Materials.Inc.
- Electrostatically secured substrate support assembly6 Oct 2026US 12,755,944 B2APPLIED Materials.Inc.
- Semiconductor manufacturing apparatus and semiconductor device manufacturing method6 Oct 2026US 12,755,946 B2Kioxia Corporation
- Remote plasma deposition with electrostatic clamping6 Oct 2026US 12,757,682 B2Lam Research Corporation
- Methods and systems for dry etching8 Oct 2026US 2026/0314324 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Substrate support and substrate processing apparatus1 Oct 2026US 2026/0302141 A1Tokyo Electron Limited
- Multi-zone heater with minimum rf loss1 Oct 2026US 2026/0302142 A1APPLIED Materials.Inc.
- Porous plug assembly, electrostatic chuck, and plasma etching apparatus1 Oct 2026US 2026/0305249 A1Advanced Micro-Fabrication Equipment Inc. China
- Temperature control member and electrostatic chuck device1 Oct 2026US 2026/0305250 A1Sumitomo Osaka Cement Co., Ltd.
Most cited
By later US patents
- CVD Processing chamber1,003US 5,558,717 AAPPLIED Materials.Inc. · 1996
- Shower head and plasma processing apparatus having same552US 8,282,769 B2Tokyo Electron Limited · 2012
- Lateral temperature equalizing system for large area surfaces during processing550US 7,195,693 B2Advanced Thermal Sciences Corp. · 2007
- Lateral temperature equalizing system for large area surfaces during processing550US 7,442,275 B2Advanced Thermal Sciences Corp. · 2008
- Methods for depositing silicon oxide501US 9,685,320 B2Lam Research Corporation · 2017