H01J 37/32715
Workpiece holder
Official title: {Workpiece holder}
H01J37/32715 (Workpiece holder) appears on 2,722 US grants and 4,456 published applications in this corpus.
Search patents in H01J- Granted patents
- 2,722
- Published applications
- 4,456
- Assignees
- 474
- Inventors
- 6,132
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 1 | 0 |
| 1990 | 1 | 0 |
| 1991 | 1 | 0 |
| 1992 | 0 | 0 |
| 1993 | 1 | 0 |
| 1994 | 0 | 0 |
| 1995 | 4 | 0 |
| 1996 | 2 | 0 |
| 1997 | 2 | 0 |
| 1998 | 3 | 0 |
| 1999 | 2 | 0 |
| 2000 | 2 | 0 |
| 2001 | 1 | 1 |
| 2002 | 4 | 6 |
| 2003 | 3 | 5 |
| 2004 | 2 | 13 |
| 2005 | 2 | 9 |
| 2006 | 6 | 17 |
| 2007 | 3 | 21 |
| 2008 | 6 | 22 |
| 2009 | 3 | 23 |
| 2010 | 9 | 28 |
| 2011 | 15 | 25 |
| 2012 | 25 | 53 |
| 2013 | 27 | 68 |
| 2014 | 43 | 104 |
| 2015 | 61 | 161 |
| 2016 | 70 | 169 |
| 2017 | 91 | 275 |
| 2018 | 136 | 265 |
| 2019 | 187 | 327 |
| 2020 | 257 | 400 |
| 2021 | 229 | 429 |
| 2022 | 272 | 470 |
| 2023 | 286 | 433 |
| 2024 | 338 | 425 |
| 2025 | 372 | 416 |
| 2026 | 253 | 291 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Shutter disc for a semiconductor processing tool6 Oct 2026US 12,753,488 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Substrate processing device and method for cleaning substrate processing device6 Oct 2026US 12,753,506 B2Jusung Engineering Co., Ltd.
- Substrate processing apparatus6 Oct 2026US 12,753,507 B2Tokyo Electron Limited
- External cooling assembly for substrate support6 Oct 2026US 12,755,943 B2APPLIED Materials.Inc.
- Electrostatically secured substrate support assembly6 Oct 2026US 12,755,944 B2APPLIED Materials.Inc.
- Etching method and plasma processing apparatus8 Oct 2026US 2026/0311969 A1Tokyo Electron Limited
- Wafer placement table8 Oct 2026US 2026/0311975 A1NGK Corporation
- Methods and systems for dry etching8 Oct 2026US 2026/0314324 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Filament for heater pedestal8 Oct 2026US 2026/0314332 A1Lam Research Corporation
- Substrate support and substrate processing apparatus1 Oct 2026US 2026/0302141 A1Tokyo Electron Limited
Most cited
By later US patents
- CVD Processing chamber1,003US 5,558,717 AAPPLIED Materials.Inc. · 1996
- Methods and apparatus for atomic layer etching577US 8,617,411 B2Lam Research Corporation · 2013
- Shower head and plasma processing apparatus having same552US 8,282,769 B2Tokyo Electron Limited · 2012
- Lateral temperature equalizing system for large area surfaces during processing550US 7,195,693 B2Advanced Thermal Sciences Corp. · 2007
- Lateral temperature equalizing system for large area surfaces during processing550US 7,442,275 B2Advanced Thermal Sciences Corp. · 2008