H01J 2237/3355
Holes or apertures, i.e. inprinted circuit boards
H01J2237/3355 (Holes or apertures, i.e. inprinted circuit boards) appears on 12 US grants and 13 published applications in this corpus.
Search patents in H01J- Granted patents
- 12
- Published applications
- 13
- Assignees
- 16
- Inventors
- 53
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1981 | 3 | 0 |
| 1982 | 1 | 0 |
| 1983 | 1 | 0 |
| 1984 | 1 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 1 |
| 2003 | 0 | 2 |
| 2004 | 0 | 1 |
| 2005 | 1 | 0 |
| 2006 | 0 | 0 |
| 2007 | 0 | 0 |
| 2008 | 0 | 1 |
| 2009 | 0 | 0 |
| 2010 | 0 | 0 |
| 2011 | 0 | 1 |
| 2012 | 1 | 0 |
| 2013 | 0 | 0 |
| 2014 | 0 | 0 |
| 2015 | 0 | 0 |
| 2016 | 0 | 0 |
| 2017 | 0 | 0 |
| 2018 | 0 | 0 |
| 2019 | 1 | 1 |
| 2020 | 0 | 1 |
| 2021 | 1 | 0 |
| 2022 | 1 | 0 |
| 2023 | 0 | 1 |
| 2024 | 0 | 1 |
| 2025 | 0 | 3 |
| 2026 | 1 | 0 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Enhanced dry desmear equipment with protective film peeling capability for integrated circuits29 Sep 2026US 12,749,660 B2Intel Corporation
- Plasma treatment apparatus and method27 Dec 2022US 11,538,664 B2Jcu Corporation
- Extraction apparatus and system for high throughput ion beam processing21 Sep 2021US 11,127,556 B2Varian Semiconductor Equipment Associates, Inc.
- Extraction apparatus and system for high throughput ion beam processing5 Nov 2019US 10,468,226 B1Varian Semiconductor Equipment Associates, Inc.
- Method and apparatus to apply surface release coating for imprint mold25 Dec 2012US 8,337,959 B2Nanonex Corporation
- Semiconductor device manufacturing method and semiconductor manufacturing apparatus20 Mar 2025US 2025/0098248 A1Kioxia Corporation
- Substrate processing apparatus6 Mar 2025US 2025/0079193 A1Tes Co., Ltd
- Multi-zone coatings on parts for galling prevention and high-temperature chemical stability13 Feb 2025US 2025/0052272 A1Lam Research Corporation
- Enhanced dry desmear equipment with protective film peeling capability for integrated circuits4 Jul 2024US 2024/0222089 A1Intel Corporation
- Method for processing semiconductor structure26 Jan 2023US 2023/0022624 A1Changxin Memory Technologies, Inc.
Most cited
By later US patents
- Gas plasma reactor for circuit boards and the like28US 4,285,800 ABranson International Plasma Corporation · 1981
- Plasma desmearing apparatus and method26US 4,328,081 AMicro-Plate, Inc. · 1982
- Plasma desmearing apparatus and method24US 4,425,210 A1984
- Uniform plasma etching system21US 4,282,077 AGeneral Dynamics, Pomona Division · 1981
- Plasma reactor and method therefor20US 4,289,598 ATechnics, Inc. · 1981